CMS Forward Pixels Assembly and Quality Control

The CMS pixel detector at the LHC will consist of two barrel layers and two end disks in the forward and backward direction. The end disks contain $\sim$800 silicon detector modules called plaquettes for a total of $\sim$18 million 100 $\times$ 150 $\mu$m pixels. Each plaquette is composed of a silicon sensor bump-bonded to custom-made readout electronics mounted on a high density interconnect. We present the automated procedures developed for assembly quality control which are sensitive to missing bump-bonds. We also discuss the module performance optimization, such as the threshold equalization among all pixels on a chip, which is necessary for physics data taking.