Study of New Anisotropic Conductive Adhesive for Bump Bonding

ORAL

Abstract

Anisotropic Conductive Adhesives (ACF) used in flip chip bump bonding allow for several pairs of aligned metal pads to be connected without placement of individual metal bumps on each pad. Typical ACFs use small spheres distributed in a bonding film. A new type of ACF described here uses vertically aligned nickel needles imbedded in thermoplastic film to make the connections. We have been investigating the suitability of this ACF for certain work in bonding chips for high energy physics detectors. Resistance of the bond has been measured under various conditions of bonding pressure, temperature, and pad size. Milliohm values of resistance have been obtained for certain condition. Procedures and results will be discussed

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Authors

  • Richard Lander

    University of California, Davis

  • Robert Fields

    University of California, Davis

  • Angela Galvez

    University of California, Davis

  • Britt Holbrook

    University of California, Davis

  • Benjamin Michlin

    University of California, Davis

  • Alexandra Moskaleva

    University of California, Davis, California State University, Sacramento

  • Christian Neher

    University of California, Davis

  • Mani Tripathi

    University of California, Davis

  • Michael Woods

    University of California, Davis