Fabrication of Direct Bonded Copper Atom Chips for Harmonic Traps

Atom chips using direct bonded copper (DBC) have greater power handling than typical lithographically produced atom chips because pure, thick (\textgreater 100 microns) copper layers are commonly obtained with DBC. We present our current fabrication techniques for DBC atom chips including: laser etching, acid etching, multi-layered chips, etc. The optimized parameters for each of these processes will be presented. Specifically, we will present the fabrication process used in the creation of a tunable harmonic trap. We will also present the design and fabrication of a chip for generating a quadrupole magnetic field for the magneto-optical trap (MOT) chip. The MOT chip is co-aligned with the harmonic trap chip to simplify transfer and optimization.