Poster Session I

POSTER · GT1

Presentations

  • Ring Vortices for Positronium Formation in Positron-Hydrogen Collisions in the Ore Gap

    POSTER

    Authors

    • S. J. Ward

      Univ of North Texas

    • Albandari W. Alrowaily

      Univ of North Texas

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Calculated electron impact dissociation cross sections for H$_{\mathrm{2}}$O$_{\mathrm{2}}$

    POSTER

    Authors

    • Andrew R. Gibson

      University of York

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    View abstract →

  • A theoretical and experimental investigation of two-center interference effects in electron impact ionization of diatomic molecules (H$_{\mathrm{2}}$ and N$_{\mathrm{2}})$.

    POSTER

    Authors

    • Sadek Amami

      Department of Physics, Missouri University of Science and Technology, Rolla, Missouri

    • Zehra N. Ozer

      Department of Physics, e-COL Laboratory, Afyon Kocatepe University, 03200, Afyon, Turkey

    • Don Madison

      Missouri Univ of Sci & Tech, Department of Physics, Missouri University of Science and Technology, Rolla, Missouri, Missouri University of Science and Technology

    View abstract →

  • Low energy electron-impact ionization of CF4.

    POSTER

    Authors

    • Esam Ali

      Missouri Univ of Sci & Tech

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Xueguang Ren

      Max-Planck-Institute for Kernphysik, Heidelberg, Germany

    • Chuangang Ning

      Department of Physics and State Key Laboratory of Low-Dimensional Quantum Physics, Tsinghua University, Beijing, People's Republic of China, Department of Physics and State Key Laboratory of Low-Dimensional Quantum Physics, Tsinghua, Department of Physics and State Key Laboratory of Low-Dimensional Quantum Physics, Tsinghua University, Beijing, People’s Republic of China

    • Alexander Dorn

      Max-Planck-Institute for Kernphysik, Heidelberg, Germany

    • Don Madison

      Missouri Univ of Sci & Tech, Department of Physics, Missouri University of Science and Technology, Rolla, Missouri, Missouri University of Science and Technology

    View abstract →

  • Photoionization Cross Sections of Phosphorus Cations: A tool for the Search of Life in the Universe

    POSTER

    Authors

    • Guillermo Hinojosa

      Univ Nacl Autonoma de Mexico

    • S. N. Nahar

      The Ohio State University, OH43210-1173, USA

    • E. M. Hern\'andez

      Univ Nacl Autonoma de Mexico

    • A. Covington

      Physics Department, University of Nevada, Reno, NV89557-0220, USA

    • L. Hern\'andez

      Univ Nacl Autonoma de Mexico

    • K. Chartkunchand

      Physics Department, University of Nevada, Reno, NV89557-0220, USA

    • A. Antillon

      Univ Nacl Autonoma de Mexico

    • A. Morales-Mori

      Univ Nacl Autonoma de Mexico

    • O. Gonzalez-Magana

      Univ Nacl Autonoma de Mexico

    • D. Hanstorp

      University of Gothenburg, SE-41296, Gothenburg, Sweden

    • A. Juarez

      Univ Nacl Autonoma de Mexico

    View abstract →

  • Fully Differential Study of Cusp Electron Production in p $+$ He, H$_{\mathrm{2}}$ Collisions

    POSTER

    Authors

    • Madhav Dhital

      Missouri Univ of Sci & Tech

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Michael Schulz

      Missouri Univ of Sci & Tech

    View abstract →

  • Modification of the Coulomb logarithm due to electron-neutral collisions

    POSTER

    Authors

    • Gerjan Hagelaar

      LAPLACE, CNRS and University of Toulouse, Universite P. Sabatier

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    View abstract →

  • Influence of electronically excited states of nitrogen and oxygen on plasma kinetics in dielectric barrier discharges.

    POSTER

    Authors

    • Vitaly Datsyuk

      Taras Shevchenko National University of Kyiv

    • Igor Izmailov

      Institute of Semiconductor Physics, National Academy of Sciences of Ukraine

    • Vadym Naumov

      Institute of Semiconductor Physics, National Academy of Sciences of Ukraine

    • Vladimir Khomich

      Institute of Physics, National Academy of Sciences of Ukraine

    • Vyacheslav Tsiolko

      Institute of Physics, National Academy of Sciences of Ukraine

    View abstract →

  • Electron desorption effect of accumulated electrons in atmospheric pressure dielectric barrier discharges

    POSTER

    Authors

    • Haruaki Akashi

      National Defense Academy, Japan

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • A kinetic description of the effects of temperature gradients in low-temperature plasmas for space propulsion

    POSTER

    Authors

    • Romain Lucken

      Laboratoire de Physique des Plasmas, LPP, Ecole Polytechnique

    • Antoine Tavant

      Laboratoire de Physique des Plasmas, LPP, Ecole Polytechnique & Safran Aircraft Engines, Laboratoire de Physique des Plasmas, Ecole Polytechnique

    • Anne Bourdon

      LPP, LPP, Ecole Polytechnique, Laboratoire de Physique des Plasmas, Laboratoire de Physique des Plasmas, Ecole Polytechnique, Ecole Polytechnique

    • Pascal Chabert

      LPP, LPP, Ecole Polytechnique, Laboratoire de Physique des Plasmas (CNRS, Ecole polytechnique, Sorbonne Universite, Universite Paris-Sud, Observatoire de Paris), Laboratoire de Physique des Plasmas, Laboratoire de Physique des Plasmas, Ecole Polytechnique, Ecole Polytechnique

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  • Basic characteristics of low temperature DC magnetized plasmas in a weakly collisional magnetic X-point configuration

    POSTER

    Authors

    • Yegeon Lim

      Department of Nuclear and Quantum Engineering, KAIST

    • Bin Ahn

      Department of Nuclear and Quantum Engineering, KAIST

    • Daeho Kwon

      Department of Nuclear and Quantum Engineering, KAIST

    • Won-jun Lee

      Department of Nuclear and Quantum Engineering, KAIST

    • Se Youn Moon

      Chonbuk National University, Chonbuk Natl Univ, Department of Quantum System Engineering, Chonbuk National University

    • Bo-sung Kim

      I.T.S.

    • Young-chul Ghim

      Department of Nuclear and Quantum Engineering, KAIST

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  • Evaluation of gas phase and wall surface chemical reactions in CF$_{\mathrm{4}}$ and C$_{\mathrm{4}}$F$_{\mathrm{8}}$ plasmas

    POSTER

    Authors

    • Xi-Feng Wang

      Dalian University of Technology,China; Princeton Plasma Phys Lab, US

    • Yuan-Hong Song

      School of Physics, Dalian University of Technology, Dalian University of Technology, Dalian University of Technology, China

    • You-Nian Wang

      Dalian University of Technology, Dalian University of Technology, China

    • Igor Kaganovich

      Princeton Plasma Phys Lab, Princeton Plasma Physics Laboratory, Princeton Plasma Phys Lab, US

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  • Influence of helium diffusion and aggregation on the variety of metal nanostructures under helium plasma irradiation

    POSTER

    Authors

    • Ilsu Mun

      Osaka Univ

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    View abstract →

  • Formation of the ion distribution function near a surface at a negative potential for gas discharge plasmas

    POSTER

    Authors

    • Alexander Mustafaev

      St. Petersburg Mining University, Saint Petersburg Mining University

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Oscar Murillo

      Saint Petersburg Mining University

    View abstract →

  • Surface photon flux dynamics during breakdown initiation

    POSTER

    Authors

    • Benjamin Yee

      Sandia Natl Labs, Sandia National Laboratories

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    View abstract →

  • Detection of anisotropy in the electron velocity distribution produced by electron cyclotron resonance heating using the polarization of helium atom emission lines

    POSTER

    Authors

    • Taiichi Shikama

      Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University

    • Tatsuya Teramoto

      Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University

    • Akira Ueda

      Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University

    • Masahiro Hasuo

      Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University

    View abstract →

  • Density of metastable O$_{2}$ (b$^{1}$$\Sigma$$^{+}$) molecules in an O$_{2}$ DC discharge measured by vacuum ultraviolet absorption and optical emission spectroscopy

    POSTER

    Authors

    • Jean-Paul Booth

      LPP, Ecole Polytechnique, LPP-CNRS, Ecole Polytechnique, Palaiseau, France, Laboratoire de Physique des Plasmas (CNRS, Ecole polytechnique, Sorbonne Universite, Universite Paris-Sud, Observatoire de Paris)

    • Abhyuday Chatterjee

      LPP-CNRS, Ecole Polytechnique, Palaiseau, France

    • Olivier Guaitella

      LPP-CNRS, Ecole Polytechnique, Palaiseau, France

    • Dmitry Lopaev

      Lomonosov Moscow State University, Russian Federation

    • Sergey Zyryanov

      Lomonosov Moscow State University, Russian Federation

    • Tatyana Rakhimova

      Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, Lomonosov Moscow State University, Russian Federation

    • Dmitry Voloshin

      Lomonosov Moscow State University, Russian Federation

    • Yuri Mankelevich

      Lomonosov Moscow State University, Russian Federation

    • Nelson de Oliveira

      Synchrotron Soleil, Gif-sur-Yvette, France, Synchrotron Soleil, Gif sur Yvette, France

    • Laurent Nahon

      Synchrotron Soleil, Gif-sur-Yvette, France, Synchrotron Soleil, Gif sur Yvette, France

    • Colin Western

      School of Chemistry, Bristol University, UK, Bristol University, UK

    View abstract →

  • MEMS based IEDF/IADF sensing: Kinetic analysis of the ion dynamics inside the sensor

    POSTER

    Authors

    • Kerstin Roessel

      Brandenburg University of Technology Cottbus-Senftenberg

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Thomas Mussenbrock

      Brandenburg University of Technology, Cottbus, Germany, Brandenburg University of Technology Cottbus - Senftenberg, Germany, Brandenburg University of Technology Cottbus-Senftenberg

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Spectroscopic Measurement of Plasma Parameters in a Helium ECR Discharge Produced under a Simple Cusp Field

    POSTER

    Authors

    • Akira Ueda

      Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University

    • Taiichi Shikama

      Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University

    • Tatsuya Teramoto

      Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University

    • Takanori Higashi

      Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University

    • Yohei Iida

      Bunkoukeiki Co.,Ltd.

    • Masahiro Hasuo

      Department of Mechanical Engineering and Science, Graduate School of Engineering, Kyoto University

    View abstract →

  • A new online training course in laboratory spectroscopic diagnostics developed at Auburn University.

    POSTER

    Authors

    • Ivan Arnold

      Auburn University

    • Stuart Loch

      Auburn Univ, Auburn University

    • Ed Thomas

      Auburn University

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    View abstract →

  • Fast Sweeping Probe System for Characterization of Spokes in ExB Discharges

    POSTER

    Authors

    • Valentin Skoutnev

      Princeton Plasma Physics Laboratory

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Yevgeny Raitses

      Princeton Plasma Phys Lab, Princeton Plasma Physics Laboratory, Princeton, NJ, USA, Princeton Plasma Physics Laboratory

    View abstract →

  • Evaluating the effects of tungsten on CFETR phase I performance

    POSTER

    Authors

    • Shengyu Shi

      Univ of Sci & Tech of China

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    View abstract →

  • Approaches for Argon-Xenon Interaction in Low Pressure Capacitively Coupled Plasmas

    POSTER

    Authors

    • Maximilian Klich

      Ruhr University Bochum, Bochum, Germany

    • Sebastian Wilczek

      Ruhr University, Bochum, Germany, Ruhr University Bochum, Germany, Ruhr University Bochum, Bochum, Germany

    • Ralf Peter Brinkmann

      Ruhr University Bochum, Bochum, Germany

    • Jesper Janssen

      PlasmaMatters B.V., Eindhoven, Netherlands

    • Thomas Mussenbrock

      Brandenburg University of Technology, Cottbus, Germany, Brandenburg University of Technology Cottbus - Senftenberg, Germany, Brandenburg University of Technology Cottbus-Senftenberg

    • Jan Trieschmann

      Brandenburg University of Technology, Cottbus, Germany

    View abstract →

  • The LisbOn Kinetics Boltzmann solver

    POSTER

    Authors

    • Antonio Tejero-del-Caz

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Luis Alves

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Vasco Guerra

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Duarte Goncalves

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Mario Lino da Silva

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Nuno Pinhao

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Luis Marques

      Centro de F\'{\i}sica da Universidade do Minho, Portugal

    • Carlos Daniel Pintassilgo

      Faculdade de Engenharia da Universidade do Porto, Portugal

    View abstract →

  • Kinetic Simulation of Hight Intensity Vacuum Beam Propagation

    POSTER

    Authors

    • Chris Moore

      Sandia Natl Labs, Sandia National Laboratories

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Benchmarks for Two Dimensional Particle-in-Cell Simulations

    POSTER

    Authors

    • Miles Turner

      Dublin City University, Ireland, Dublin City University

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • The role of electron-electrode collisions and secondary electrons in radio-frequency breakdown

    POSTER

    Authors

    • Marija Puac

      Institute of Physics, University of Belgrade, Pregrevica 118, Zemun, Belgrade, 11080, Serbia

    • Antonije Djordjevic

      School of Electrical Engineering, University of Belgrade, Belgrade, 11120, Serbia, Serbian Academy of Sciences and Arts, 11001, Belgrade

    • Zoran Lj Petrovic

      Institute of Physics, University of Belgrade, Pregrevica 118,Belgrade, 11080, Serbia, Serbian Academy of Sciences and Arts, 11001 Belgrade

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  • The LisbOn Kinetics tool suit

    POSTER

    Authors

    • Antonio Tejero-del-Caz

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Luis Alves

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Vasco Guerra

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Duarte Goncalves

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Mario Lino da Silva

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Nuno Pinhao

      Instituto de Plasmas e Fus\~{a}o Nuclear, Instituto Superior T\'{e}cnico, Universidade de Lisboa, Portugal

    • Luis Marques

      Centro de F\'{\i}sica da Universidade do Minho, Portugal

    • Carlos Daniel Pintassilgo

      Faculdade de Engenharia da Universidade do Porto, Portugal

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  • Multi-physics simulation of the COST APPJ in the MOOSE framework

    POSTER

    Authors

    • Corey DeChant

      North Carolina State University

    • Shane Keniley

      University of Illinois, Univ of Illinois - Urbana

    • Davide Curreli

      Univ of Illinois - Urbana, University of Illinois, University of Illinois - Urbana Champaign

    • Katharina Stapelmann

      North Carolina State Univ, North Carolina State University

    • Steven Shannon

      North Carolina State University

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  • Self-Consistent Circuit Model for Pulsed Inductively Coupled Plasmas

    POSTER

    Authors

    • Carl Smith

      North Carolina State University

    • Joel Brandon

      North Carolina State University

    • Steven Shannon

      North Carolina State University

    • Peng Tian

      University of Michigan

    • Mark J. Kushner

      University of Michigan, Univ. Michigan, University of Michigan - Ann Arbor, Univ of Michigan - Ann Arbor

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Interface model of plasma-surface interactions using artificial neural networks

    POSTER

    Authors

    • Florian Krueger

      Ruhr University Bochum, Germany

    • Tobias Gergs

      Ruhr University Bochum, Germany

    • Thomas Mussenbrock

      Brandenburg University of Technology, Cottbus, Germany, Brandenburg University of Technology Cottbus - Senftenberg, Germany, Brandenburg University of Technology Cottbus-Senftenberg

    • Jan Trieschmann

      Brandenburg University of Technology Cottbus-Senftenberg, Brandenburg University of Technology, Cottbus, Germany, Brandenburg University of Technology Cottbus - Senftenberg, Germany

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  • Electron-induced secondary electrons in low-pressure capacitively coupled radio-frequency plasmas

    POSTER

    Authors

    • Benedek Horvath

      Wigner Research Centre for Physics, Budapest, Hungary, Wigner Research Centre for Physics

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Verification of Collisional Models in the Aleph PIC-DSMC Code

    POSTER

    Authors

    • Jeremiah Boerner

      Sandia National Laboratories

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Numerical simulation and stability analysis of a spark discharge high-voltage switch.

    POSTER

    Authors

    • Vasily Kozhevnikov

      Institute of High Current Electronics

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Comparison of PIC-MCC and fluid simulations for the description of ccrf discharges

    POSTER

    Authors

    • Hanno Kaehlert

      Kiel University, ITAP, 24098 Kiel, Germany

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Two-dimension numerical simulation of a micro plasma electron source at moderate pressure

    POSTER

    Authors

    • C Lan

      Princeton Plasma Physics Laboratory and Institute of Fluid Physics, China Academy of Engineering Physics

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • DC glow discharge investigation in CO2 by optical emission spectroscopy

    POSTER

    Authors

    • V.A. Lisovskiy

      V.N. Karazin Kharkiv National University, V.N. Karazin Kharkiv National University, 61022, Kharkov

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • DC glow discharge in nitrogen with hollow cathode or anode

    POSTER

    Authors

    • V.A. Lisovskiy

      V.N. Karazin Kharkiv National University, V.N. Karazin Kharkiv National University, 61022, Kharkov

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Pseudospark discharge as a sheet electron beam source for mm-wave generation

    POSTER

    Authors

    • K Ronald

      SUPA and Department of Physics, University of Strathclyde, Glasgow, UK

    • H Yin

      SUPA and Department of Physics, University of Strathclyde, Glasgow, UK

    • A Cross

      SUPA and Department of Physics, University of Strathclyde, Glasgow, UK

    • L Zhang

      SUPA and Department of Physics, University of Strathclyde, Glasgow, UK

    • W He

      SUPA and Department of Physics, University of Strathclyde, Glasgow, UK

    • A Phelps

      SUPA and Department of Physics, University of Strathclyde, Glasgow, UK

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Design and measurement of a Penning discharge plasma

    POSTER

    Authors

    • K Ronald

      SUPA and Department of Physics, University of Strathclyde, Glasgow, UK

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Nonlocal and nonlinear dynamics in low pressure capacitively coupled radio frequency discharges

    POSTER

    Authors

    • Sebastian Wilczek

      Ruhr University, Bochum, Germany, Ruhr University Bochum, Germany, Ruhr University Bochum, Bochum, Germany

    • Jan Trieschmann

      Brandenburg University of Technology Cottbus-Senftenberg, Brandenburg University of Technology, Cottbus, Germany, Brandenburg University of Technology Cottbus - Senftenberg, Germany

    • Julian Schulze

      Ruhr-University Bochum, Germany, Ruhr-University Bochum, Germany, West Virginia University, USA, Ruhr University, Bochum, Germany, Ruhr University Bochum, Germany

    • Ralf Peter Brinkmann

      Ruhr University, Bochum, Germany, Ruhr University Bochum, Germany, Ruhr University Bochum, Bochum, Germany

    • Zoltan Donko

      Hungarian Academy of Sciences, Hungary, Hungarian Academy of Sciences, Budapest, Hungary, Wigner Research Centre for Physics, Budapest, Hungary

    • Thomas Mussenbrock

      Brandenburg University of Technology, Cottbus, Germany, Brandenburg University of Technology Cottbus - Senftenberg, Germany, Brandenburg University of Technology Cottbus-Senftenberg

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  • Nonlocal Dynamics of Secondary Electrons in Low Pressure Capacitively Coupled Plasmas

    POSTER

    Authors

    • Katharina Noesges

      Ruhr University, Bochum, Germany

    • Aranka Derzsi

      West Virginia University, Wigner Research Centre for Physics, Budapest, Hungary

    • Benedek Horvath

      Wigner Research Centre for Physics, Budapest, Hungary, Wigner Research Centre for Physics

    • Thomas Mussenbrock

      Brandenburg University of Technology, Cottbus, Germany, Brandenburg University of Technology Cottbus - Senftenberg, Germany, Brandenburg University of Technology Cottbus-Senftenberg

    • Ralf Peter Brinkmann

      Ruhr University, Bochum, Germany, Ruhr University Bochum, Germany, Ruhr University Bochum, Bochum, Germany

    • Julian Schulze

      Ruhr-University Bochum, Germany, Ruhr-University Bochum, Germany, West Virginia University, USA, Ruhr University, Bochum, Germany, Ruhr University Bochum, Germany

    • Sebastian Wilczek

      Ruhr University, Bochum, Germany, Ruhr University Bochum, Germany, Ruhr University Bochum, Bochum, Germany

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  • Effects of charged particle dynamics, process control, and surface characteristics on spatio-temporal behavior in capacitive RF plasmas

    POSTER

    Authors

    • S. Brandt

      West Virginia Univ

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • The excitation of the Bernstein waves in magnetized capacitive helium discharge.

    POSTER

    Authors

    • Shali Yang

      Huazhong University of Science and Technology China; Princeton Plasma Physics Lab

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    View abstract →

  • Experimental investigation of the generation of multiple electron beams during the sheath expansion phase in capacitive RF plasmas

    POSTER

    Authors

    • Birk Berger

      BTU Cottbus-Senftenberg, Germany; Ruhr-University Bochum, Germany

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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  • Correlation between electron temperature and plasma power in inductively coupled plasma

    POSTER

    Authors

    • Hyo-Chang Lee

      Korea Research Inst of Standards and Science (KRISS)

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    View abstract →

  • The dynamics of the electron impact excitation in pulse-modulated Ar/O2 inductive coupled plasmas.

    POSTER

    Authors

    • Fei Gao

      Dalian University of Technology

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • You-Nian Wang

      Dalian University of Technology, Dalian University of Technology, China

    View abstract →

  • Three-dimensional Measurements of plasma properties in an industrial etch tool

    POSTER

    Authors

    • Walter Gekelman

      Univ of California - Los Angeles, University of California Los Angeles

    • Jia Han

      Univ of California - Los Angeles, University of California Los Angeles

    • Patrick Pribyl

      Univ of California - Los Angeles, University of California Los Angeles

    • Alex Paterson

      LAM Corp

    • Mark J. Kushner

      University of Michigan, Univ. Michigan, University of Michigan - Ann Arbor, Univ of Michigan - Ann Arbor

    • Steve Lantham

      Univ. Michigan

    View abstract →

  • Benchmarking and validation of global model code for negative hydrogen ion sources.

    POSTER

    Authors

    • Wei Yang

      Dalian University of Technology, China and Princeton Plasma Phys Lab

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

    • Steve Shannon

      Tohoku University, Yokohama National University, ITER-India, Institute for Plasma Research, Gandhinagar, India and HBNI, Mumbai, Group in Computational Science and HPC, DAIICT, Gandhinagar, India, Ruhr University Bochum, Leuphana University Lüneburg, Korea Research Institute of Standards and Science (KRISS), Korea Institute of Machinery and Materials (KIMM), Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam Natl Univ, Applied Materials Inc., 1140 E. Arques Avenue Sunnyvale, California 94085, North Carolina State University, Nagoya University, Meijo University, School of Computing and Engineering, University of Huddersfield, Huddersfield, UK, York Plasma Institute, Department of Physics, University of York, York, UK, Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, 17489 Greifswald, Germany, TEL Technology Center America, Inc., The University of Texas at Austin, Esgee Technologies, Tokyo Electron America, Inc., University of Glasgow, Leibniz Institute for Plasma Science and Technology (INP), Advanced Research Center for Nanolithography, Los Alamos Natl Lab, Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Russia, University of Michigan, Australian National University, University of York, The University of Tokyo, University of Notre Dame, Tokyo Metropolitan Univ, Texas A&M University, Tarleton State University, Nagoya University, Japan, Asahi Glass Company, Ltd., Japan, Toyota Technological Institute, Japan, Ruhr University Bochum, Germany, Ferdinand-Braun-Institut, Germany, Univ of Michigan - Ann Arbor, NASA Jet Propulsion Laboratory, Ad Astra Rocket Company, University of Houston, University P. Sabatier, Air Force Research Lab - Edwards AFB, Holon Inst of Technology, Stony Brook University, Texas A\&M University, Princeton University, Electrodynamics and Physical Electronics Group, Brandenburg University of Technology, Institute of Theoretical Electrical Engineering, Ruhr University Bochum, Applied Materials Inc, School of Physics, Dalian University of Technology, Ruhr-University Bochum, PlasmaPotential - Physics Consulting and Research, Hungarian Academy of Sciences, Univ of Illinois - Urbana, Paderborn University, Michigan State Univ, Kyushu University, Department of Applied Physics, Ghent University, Belgium, National Institute of Laser, Plasma and Radiation, Romania, Samsung Electronics Co., Ulster University, Christian-Albrechts-University Kiel, Los Alamos National Laboratory, Curtin University, Stockholm University, Swansea University, Institut de Mecanique des Fluides de Toulouse (IMFT), Universite de Toulouse, CNRS, INPT, UPS, France, UMR-CNRS 6226, Sciences Chimiques de Rennes, Universite de Rennes 1, France, Department of Graphic Arts and Photophysics, University of Pardubice, Czech Republic, Institut des Materiaux Jean Rouxel, Universite de Nantes, CNRS, France, Hitachi Ltd., Research Development Group, Columbia University, National University of Defense Technology, Applied Materials, Queen's University Belfast UK, Seikei University, Tokyo, Japan, Kwangwoon University, Institute of Fluid Physics, CAEP, Institute for Plasma Research, Tokai Univ, Chubu Electric Power Co., Inc., Plasma Research Laboratory CO.LTD, Tokai University, Nihon University, Joint Institute for High Temperatures, RUSSIA, V. N. Karazin Kharkiv National University, Ukraine, Princeton Plasma Physics Laboratory, Lawrence Berkeley National Laboratory, RadiaSoft LLC, Ioffe Institute RAS, St. Petersburg State University, St. Petersburg Mining University, George Washington University, ISAE, University of Toulouse, LAPLACE, CNRS and University of Toulouse, Dalian University of Technology, Universite Paris 13 - LSPM CNRS UPR 3407, West Virginia University, Dep. Electrical Engineering, Hanyang University, Seoul, Republic of Korea, Japan Coast Guard Academy, University of Hyogo, Osaka University, Kyoto Inst of Tech, Dalian Nationalities University, Hokkaido University, Texas A&M Univ, Tokyo City University, Tokyo city University, Tokyo city university, National Fusion Research Institute, Tokyo Metropolitan University, TU Braunschweig, Institute for Surface Technology, Bienroder Weg 54, 38108 Braunschweig, Germany, Groupe des Couches Minces (GCM) and Department of Engineering Physics, Polytechnique Montr{\'e}al, Montreal QC, Canada H3C 3A7, Empa, Swiss Federal Laboratories for Materials Science and Technology, Plasma \& Coating Group, Lerchenfeldstr.~5, 9014 St. Gallen, Switzerland, Technion, Rafael, University of Saskatchewan, Hanyang University, Hanyang Univ, Applied Physics lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Applied Materials, Inc., Seikei University, The University of Shiga Prefecture, Kyoto University, Ruhr University Bochum, West Virginia University, Instituto de Plasmas e Fusao Nuclear, Instituto Superior Tecnico, Universidade de Lisboa, 1049-001 Lisboa, Portugal, LPP, CNRS, Ecole Polytechnique, UPMC, Universite Paris-Saclay, 91128 Palaiseau, France, Lawrence Livermore National Laboratory, Illinois Applied Research Institute, Univ. of Illinois Urbana-Champaign, Semiconductor R\&D Center, Samsung Electronics, ET Center, Samsung R\&D Institute Japan, Univ of California - San Diego, Obukhov Institute of Atmospheric Physics RAS, Moscow, Moscow Power Engineering Institute, Moscow, Hokkaido Univ, Michigan State University, Institute for High Temperatures of RAS, Universidade da Madeira, Facility for Rare Isotope Beams, Michigan State University, National Superconducting Cy- clotron Laboratory, Michigan State University, Universite de Montreal, Max Planck Institute for Plasma Physics, Garching, Germany, SMDC, Redstone Arsenal, UAH Systems Management and Production Center, University of Science and Technology of China, Hefei 230026, China, Max-Planck-Institute for Kernphysik, Heidelberg, Germany, Dalian University of Technology, China, Princeton Plasma Phys Lab, Tech-X Corporation, University of Colorado, and Worcester Polytechnic Institute, USA, Department of Electrical Engineering, Hanyang University, Applied Physics, California Institute of Technology, Plasma Technology Research Center, Nation Fusion Research Institute, Korea Research Inst of Standards and Science (KRISS), Ruhr-University Bochum, Germany, BTU Cottbus-Senftenberg, Germany, Korea Research Institute of Standards and Science, Republic of Korea, Semiconductor R&D Center, Samsung Electronics Co., Ltd., Republic of Korea, Princeton Plasma Physics Lab, Huazhong University of Science & Technology, Institute for Plasma Research India, Lam Research Corp, Ruhr-Univ Bochum, Wigner Research Centre for Physics, West Virginia Univ, Department of Physics, West Virginia University, Morgantown, USA, SUPA and Department of Physics, University of Strathclyde, Glasgow, UK, School of Physical Electronics, University of Electronic Science & Technology of China, Chengdu, China, High Voltage Division, School of Electrical Engineering, Xi’an Jiaotong University, Xi’an, China, College of Electronic Science and Technology, Shenzhen University, Shenzhen, China, V.N. Karazin Kharkiv National University, LPP, Ecole Polytechnique, Palaiseau, France, V.N. Karazin Kharkiv National University, 61022, Kharkov, Leibniz Institute for Plasma Science and Technology, 17489 Greifswald, Germany, Kiel University, ITAP, 24098 Kiel, Germany, Institute of High Current Electronics, Tomsk Polytechnic University, Sandia National Laboratories, West Virginia University, Wigner Research Centre for Physics, Ruhr-University Bochum, West Virginia University, Samsung Electronics, Tech-X Corporation, U. S. A., Brandenburg University of Technology, Germany, Ecole Polytechnique, France, Hungarian Academy of Sciences, Budapest, Ruhr University, Germany, CEA/CESTA, Sandia Natl Labs, Univ of Sci & Tech of China, UCSD, AU Online, Technical University Chemnitz, Brandenburg University of Technology Cottbus-Senftenberg, Saint Petersburg Mining University, Osaka Univ, National Institute for Fusion Science, National Defense Academy, Japan, Troitsk Institute for Innovation and Fusion Research, Wigner Research Center for Physics, Hungary, Missouri Univ of Sci & Tech, Tblisi State University, University College London, LSPM-CNRS, LPGP-CNRS, West Virginia University, Morgantown, USA; Ruhr-University Bochum, Germany, University of York, Heslington, UK, Brandenburg University of Technology, Cottbus, Germany, Hungarian Academy of Sciences, Budapest, Hungary, Insitute of Modern Physics Lanzhou, Drexel University, Institute of Electrical Engineering, Ruhr-University Bochum, Germany Department of Physics, West Virginia University, USA, Wigner Research Centre for Physics, Hungary, Department of Physics, West Virginia University, USA, Idaho National Laboratory, Oak Ridge National Laboratory, Old Dominion University, University of San Francisco, CERFACS, CERFACS - now ONERA, University of Illinois, North Carolina State Universty

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