Advancing 3D RF Plasma Simulations: Bridging the Gap with a Semi-Implicit Solver, Hybrid PIC Methods, and Integrated CAD-to-Results Workflow

Advancements in RF Plasma simulations, particularly for Plasma-Enhanced Chemical Vapor Deposition (PECVD), are crucial for developing next-generation materials and technologies. Traditional plasma solvers often struggle with efficiently handling the disparate timescales and length scales associated with RF plasmas. Our novel 3D FEM-based plasma solver addresses these challenges through an exactly energy-conserving Semi-Implicit method, hybrid PIC-Fluid options, advanced time-stepping techniques, and small-scale sheath modeling enhanced with subscale meshing and sub-simulations.



To manage complex chemical reactions, our solver utilizes a combination of scattering cross-sections and bulk reaction rates. Additionally, it integrates seamlessly with Ansys Chemkin, enabling detailed handling of sophisticated chemical reaction networks. SPICE circuit modeling capabilities are incorporated to effectively manage complex boundary conditions.



To ensure accessibility and usability for engineers and designers, our plasma solver is fully integrated into Ansys Discovery. This integration facilitates a complete CAD-to-results workflow, enabling seamless design, simulation, and analysis of PECVD and RF plasma discharge processes. The new 3D FEM-based plasma tool significantly accelerates research and development by offering a robust and efficient solution for RF plasma simulations, directly supporting PECVD characterization, design, and development.