Patterning of Multiple Block Copolymers per Layer with Orthogonal Processing
ORAL
Abstract
In this work we demonstrate the concept of orthogonal processing of block copolymers. By using a semi-flourinated photoresist/solvent system, we are able to selectively pattern or lift-off and then recover the block copolymer film intact. This approach can enable removable templating of self- assembly and also multiple block copolymers, morphologies or domain sizes on the same layer which can open the door to self-assembly of a wider range of geometries than possible before. We highlight the interplay between the various parameters for a successful additive and subtractive patterning and directions for further theoretical investigation as well as the limitations of this technique.
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Authors
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Wei Min Chan
Department of Electrical Engineering, Cornell University
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Evan L. Schwartz
Department of Materials Science and Engineering, Cornell University
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Jin-Kyun Lee
Department of Polymer Science and Engineering, Inha University
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Joan K. Bosworth
Hitachi Global Storage Technologies
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John DeFranco
Orthogonal Inc
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Sandip Tiwari
Cornell University, Department of Electrical Engineering, Cornell University
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Christopher K. Ober
Cornell University, Department of Materials Science and Engineering, Cornell University