Patterning of Multiple Block Copolymers per Layer with Orthogonal Processing

ORAL

Abstract

In this work we demonstrate the concept of orthogonal processing of block copolymers. By using a semi-flourinated photoresist/solvent system, we are able to selectively pattern or lift-off and then recover the block copolymer film intact. This approach can enable removable templating of self- assembly and also multiple block copolymers, morphologies or domain sizes on the same layer which can open the door to self-assembly of a wider range of geometries than possible before. We highlight the interplay between the various parameters for a successful additive and subtractive patterning and directions for further theoretical investigation as well as the limitations of this technique.

Authors

  • Wei Min Chan

    Department of Electrical Engineering, Cornell University

  • Evan L. Schwartz

    Department of Materials Science and Engineering, Cornell University

  • Jin-Kyun Lee

    Department of Polymer Science and Engineering, Inha University

  • Joan K. Bosworth

    Hitachi Global Storage Technologies

  • John DeFranco

    Orthogonal Inc

  • Sandip Tiwari

    Cornell University, Department of Electrical Engineering, Cornell University

  • Christopher K. Ober

    Cornell University, Department of Materials Science and Engineering, Cornell University