Probing voltage induced bond rupture in a molecular junction

ORAL

Abstract

We use scanning tunneling microscope break junction to study electric field breakdown at the single molecule level. We investigate breakdown phenomena in atomic chains composed of Si---Si, Si---O, Si---C, Ge---Ge and C---C bonds that are commonly found in the low-$\kappa$ dielectric material. We see different bond rupture behaviors in a range of molecular backbones, and use the results from a statistically large number of measurements to determine which bond breaks. We find that Si---Si and Ge---Ge bonds rupture above a 1V bias. We also find that the Si---C bond is more robust than Si---O or Si---Si bond at above 1V. Finally, we illustrate how an additional conductance pathway in parallel to the Si---Si bond changes bond rupture behavior under an electric field. We carry out ab initio calculations on these systems and demonstrate that the mechanism for bond rupture under electric field involves {\lq\lq}heating{\rq\rq} of the molecule through electron-vibrational mode coupling.

Authors

  • Haixing Li

    Department of Applied Physics and Applied Mathematics, Columbia University

  • Timothy Su

    Department of Chemistry, Columbia University

  • Nathaniel Kim

    Department of Chemistry, Columbia University

  • Pierre Darancet

    Argonne Natl Lab, The Center for Nanoscale Materials, ANL, Argonne National Laboratory Center for Nanoscale Materials, Argonne National Laboratory

  • James Leighton

    Department of Chemistry, Columbia University

  • Michael Steigerwald

    Department of Chemistry, Columbia University

  • Colin Nuckolls

    Department of Chemistry, Columbia University

  • Latha Venkataraman

    Department of Applied Physics and Applied Mathematics, Columbia University, Columbia University, Department of Applied Physics and Applied Mathemathics