Single-electron devices fabricated using double-angle deposition and plasma oxidation
ORAL
Abstract
We report on development of plasma oxidized, single-electron transistors (SETs) where we seek low-capacitance and small-area Al/AlOx/Al tunnel junctions with small charge offset drift. Performance of metal-based SET quantum devices and superconducting devices has suffered from long-term charge offset drift, high defect densities and charge noise. We use plasma oxidation to lower defect densities of the oxide layer, and adjustable deposition angles to control the overlapping areas for Al/AlOx/Al tunnel junctions. Current-voltage and charge offset drift measurements are planned for cryogenic temperatures. Other electrical properties will be measured at room temperature. We hope to see Coulomb blockade oscillations on these devices and better charge offset stability than typical Al/AlOx/Al SETs.
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Authors
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Y. Hong
National Institute of Standards and Technology
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Z. S. Barcikowski
National Institute of Standards and Technology
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A. N. Ramanayaka
Joint Quantum Institute, Univ of Maryland-College Park, National Institute of Standards and Technology, Joint Quantum Institute, National Institute of Standards and Technology
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M. D. Stewart Jr.
National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA, National Institute of Standards and Technology
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N. M. Zimmerman
National Institute of Standards and Technology, Gaithersburg, Maryland 20899, USA, NIST, National Institute of Standards and Technology
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J. M. Pomeroy
National Institute of Standards and Technology