Direct Observation of Polymer Surface Mobility via Nanoparticle Vibrations
ORAL
Abstract
Understanding the mechanical properties of polymers nanoparticles (NPs) is essential to optimizing their performance and processing. The glass transition temperature (Tg) plays a crucial role in processing these and other polymeric materials. Polymer NPs show Tg deviations similar to that of polymer thin films, which has been attributed to the mobility of a surface mobile layer with reduced Tg. However, due to the lack of an experimental means, the existence of a surface mobile layer has yet to be directly verified. We studied the vibrational dynamics of polystyrene NP clusters by Brillouin light scattering. Since eigenmodes of the NP cluster are controlled by the elastic moduli and the interactions between NPs, the temperature dependent variation in the spectra allows us to not only measure Tg of NPs, but also to verify the presence of a surface mobile layer. Below Tg, the contact adhesion is enhanced due to an active surface mobile layer which introduces unique thermal variation of eigenmodes. The calculated phonon dispersion supports that this abnormal thermal transition is induced by sudden increase in adhesion area among neighboring NPs at a temperature Ts that is lower than the bulk Tg.
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Presenters
Hojin Kim
Department of Chemical and Biomolecular Engineering, University of Delaware
Authors
Hojin Kim
Department of Chemical and Biomolecular Engineering, University of Delaware
Eric Furst
Chemical and Biomolecular Engineering, University of Delaware, Department of Chemical and Biomolecular Engineering, University of Delaware
Yu Cang
Max Planck Institute for Polymer Research
Eunsoo Kang
Max Planck Institute for Polymer Research
Bartlomiej Graczykowski
Max Planck Institute for Polymer Research
George Fytas
Max Planck Institute for Polymer Research
Maria Secchi
University of Trento
Maurizio Montagna
University of Trento
Rodney Priestley
Chemical and Biological Engineering, Princeton University, Department of Chemical and Biological Engineering, Princeton University, Princeton University, Princeton Univ