Weak localization in variable-concentration embedded phosphorus delta layers in silicon produced by variable PH3 dosing
ORAL
Abstract
The key building block for devices based on the deterministic placement of dopants in Si is the formation of P dopant monolayers and the overgrowth of high quality crystalline Si. Lithographically defined dopant δ-layers can be formed with an STM, which can pattern device features on a H-terminated silicon surface by exposing Si dangling bonds at specific locations and placing P at these locations with atomic precision by exposing the surface to PH3. The motivation for this research is to advance the dopant formation and overgrowth processes necessary to produce prototypical few-atom devices in a controlled solid-state environment. Our earlier work has demonstrated that a careful magnetotransport study at low T, along with analysis of the weak localization (WL) feature, allows us to extract parameters associated with the electronic transport that offer a meaningful quantitative characterization of δ-layer quality and dopant diffusion, with better resolution than the more commonly used SIMS. We build on this work by examining the effect on the transport and WL behaviors in a set of samples with Si:P delta layers produced with different PH3 exposure procedures prior to a standard Si encapsulation. Here, we describe the overall methodology and the findings of this study.
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Presenters
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Joseph Hagmann
- National Institute of Standards and Technology
- NIST -Natl Inst of Stds & Tech