Superconducting Circuits: Design and Packaging

FOCUS · R33

Presentations

  • Implementations of Superconducting Circuits for Quantum Computing

    Invited

    –

    Presenters

    • David Pappas

      NIST, National Institute of Standards and Technology, NIST - Boulder

    Authors

    • David Pappas

      NIST, National Institute of Standards and Technology, NIST - Boulder

    • Hsiang-Sheng Ku

      NIST

    • Junling Long

      National Institute of Standards and Technology, NIST - Boulder, NIST

    • Mustafa Bal

      National Institute of Standards and Technology, NIST

    • Xian Wu

      National Institute of Standards and Technology, NIST

    • Russell Lake

      National Institute of Standards and Technology, NIST - Boulder, NIST, QCD Labs, Department of Applied Physics, Aalto University

    • Nicholas Bronn

      IBM T. J. Watson Research Center, IBM TJ Watson Research Center, IBM, IBM T J Watson Res Ctr

    • Vivekananda Adiga

      IBM TJ Watson Research Center, IBM

    • Salvatore Olivadese

      IBM TJ Watson, IBM TJ Watson Research Center, IBM, IBM T J Watson Res Ctr

    • Baleegh Abdo

      IBM T J Watson Res Ctr, IBM

    • Jerry Chow

      IBM T.J. Watson Research Center, IBM T. J. Watson Research Center, IBM TJ Watson, IBM TJ Watson Research Center, IBM, IBM T J Watson Res Ctr, IBM T J Watson Research Center

    • Robert Erickson

      NIST

    View abstract →

  • Flip Chip Packaging for Superconducting Quantum Computers

    ORAL

    –

    Presenters

    • Adel Elsherbini

      Components Research, Intel Corporation

    Authors

    • Adel Elsherbini

      Components Research, Intel Corporation

    • Javier Falcon

      Intel Corporation, Assembly Technology Test and Development, Intel Corporation

    • Jeanette Roberts

      Components Research, Intel Corporation, Intel Corporation

    • Roman Caudillo

      Components Research, Intel Corporation, Intel Corporation

    • Stefano Poletto

      QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Kavli Institute of Nanoscience Delft, Delft University of Technology

    • Ye Seul Nam

      Assembly Technology Test and Development, Intel Corporation

    • David Michalak

      Components Research, Intel Corporation, Intel Corporation

    • Lester Lampert

      Intel Corporation, Components Research, Intel Corporation

    • Zachary Yoscovits

      Intel Corporation, Components Research, Intel Corporation

    • Joe Saucedo

      Assembly Technology Test and Development, Intel Corporation

    • Alessandro Bruno

      QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Kavli Institute of Nanoscience Delft, Delft University of Technology, QuTech, Delft Univ. of Technology

    • James Clarke

      Components Research, Intel Corporation, Intel Corporation

    • Leonardo DiCarlo

      QuTech and Kavli Institute of Nanoscience, Delft University of Technology, TUD Faculty of Sciences, QuTech, Kavli Institute of Nanoscience Delft, Delft University of Technology

    View abstract →

  • Die Design and Fabrication for Flip-Chip-Packaged Superconducting Quantum Processors

    ORAL

    –

    Presenters

    • Roman Caudillo

      Components Research, Intel Corporation, Intel Corporation

    Authors

    • Roman Caudillo

      Components Research, Intel Corporation, Intel Corporation

    • Zachary Yoscovits

      Intel Corporation, Components Research, Intel Corporation

    • Lester Lampert

      Intel Corporation, Components Research, Intel Corporation

    • David Michalak

      Components Research, Intel Corporation, Intel Corporation

    • Adel Elsherbini

      Intel Corporation

    • Javier Falcon

      Intel Corporation, Assembly Technology Test and Development, Intel Corporation

    • Jeanette Roberts

      Components Research, Intel Corporation, Intel Corporation

    • Leonardo DiCarlo

      QuTech and Kavli Institute of Nanoscience, Delft University of Technology, TUD Faculty of Sciences, QuTech, Kavli Institute of Nanoscience Delft, Delft University of Technology

    • James Clarke

      Components Research, Intel Corporation, Intel Corporation

    View abstract →

  • Towards large-scale superconducting quantum annealers: 2.5D packaging technology and application specific architecture

    ORAL

    –

    Presenters

    • Shiro Kawabata

      National Institute of Advanced Industrial Science and Technology (AIST)

    Authors

    • Shiro Kawabata

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Kazuhiko Endo

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Go Fujii

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Mutsuo Hidaka

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Masakazu Hioki

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Kentaro Imafuku

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Kunihiro Inomata

      National Institute of Advanced Industrial Science and Technology (AIST), AIST

    • Vasilios Karanikolas

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Toshihiro Katashita

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Katsuya Kikuchi

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Hanpei Koike

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Satoshi Kohjiro

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Masaaki Maezawa

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Kazumasa Makise

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Shuichi Nagasawa

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Hiroshi Nakagawa

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Tadashi Nakagawa

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Toshihiro Sekigawa

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Masahiro Ukibe

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Chiharu Watanabe

      National Institute of Advanced Industrial Science and Technology (AIST), AIST

    • Takahiro Yamada

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Hirotake Yamamori

      National Institute of Advanced Industrial Science and Technology (AIST)

    View abstract →

  • Scalable device structure for large-scale superconducting quantum annealing machines

    ORAL

    –

    Presenters

    • Mutsuo Hidaka

      National Institute of Advanced Industrial Science and Technology (AIST)

    Authors

    • Mutsuo Hidaka

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Masaaki Maezawa

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Kazumasa Makise

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Shuichi Nagasawa

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Takahiro Yamada

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Kunihiro Inomata

      National Institute of Advanced Industrial Science and Technology (AIST), AIST

    • Go Fujii

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Hirotake Yamamori

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Masahiro Ukibe

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Shiro Kawabata

      National Institute of Advanced Industrial Science and Technology (AIST)

    View abstract →

  • Superconducting solder bumping technology for scalable quantum annealing machines

    ORAL

    –

    Presenters

    • Kazumasa Makise

      National Institute of Advanced Industrial Science and Technology (AIST)

    Authors

    • Kazumasa Makise

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Masaaki Maezawa

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Mutsuo Hidaka

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Hiroshi Nakagawa

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Katsuya Kikuchi

      National Institute of Advanced Industrial Science and Technology (AIST)

    View abstract →

  • Fabrication of Sn-filled superconducting through-silicon vias (SC-TSV) for large-scale superconducting quantum circuits

    ORAL

    –

    Presenters

    • Go Fujii

      National Institute of Advanced Industrial Science and Technology (AIST)

    Authors

    • Go Fujii

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Masahiro Ukibe

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Kazumasa Makise

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Mutsuo Hidaka

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Shuichi Nagasawa

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Hirotake Yamamori

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Kunihiro Inomata

      National Institute of Advanced Industrial Science and Technology (AIST), AIST

    • Takahiro Yamada

      National Institute of Advanced Industrial Science and Technology (AIST)

    • Shiro Kawabata

      National Institute of Advanced Industrial Science and Technology (AIST)

    View abstract →

  • Enabling technologies for increased circuit complexity of high-coherence superconducting qubits: Part 1

    ORAL

    –

    Presenters

    • Jonilyn Yoder

      MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    Authors

    • Jonilyn Yoder

      MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • David Kim

      MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Peter Baldo

      MIT Lincoln Laboratory

    • Gregory Calusine

      MIT Lincoln Laboratory

    • Alexandra Day

      MIT Lincoln Laboratory

    • George Fitch

      MIT Lincoln Laboratory

    • Michael Hellstrom

      MIT Lincoln Laboratory

    • Eric Holihan

      MIT Lincoln Laboratory

    • David Hover

      MIT Lincoln Laboratory

    • Bethany Niedzielski

      MIT Lincoln Laboratory

    • Brenda Osadchy

      MIT Lincoln Laboratory

    • Danna Rosenberg

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Gabriel Samach

      MIT Lincoln Laboratory

    • Steven Weber

      MIT Lincoln Laboratory

    • William Oliver

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology & MIT Lincoln Laboratory, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT, MIT, Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology

    View abstract →

  • Enabling technologies for increased circuit complexity of high-coherence superconducting qubits: Part 2

    ORAL

    –

    Presenters

    • David Kim

      MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    Authors

    • David Kim

      MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Jonilyn Yoder

      Massachusetts Institute of Technology, MIT Lincoln Laboratory

    • Rabindra Das

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Danna Rosenberg

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Peter Baldo

      MIT Lincoln Laboratory

    • Gregory Calusine

      MIT Lincoln Laboratory

    • Michael Hellstrom

      MIT Lincoln Laboratory

    • Bethany Niedzielski

      MIT Lincoln Laboratory

    • Justin Mallek

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

    • Alexander Melville

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Brenda Osadchy

      MIT Lincoln Laboratory

    • Donna-Ruth Yost

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

    • Livia Racz

      MIT Lincoln Laboratory

    • William Oliver

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology & MIT Lincoln Laboratory, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT, MIT, Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology

    View abstract →

  • Extending Plane Breaking Pogo Packaging to a Lattice of 17 Superconducting Qubits

    ORAL

    –

    Presenters

    • Nicholas Bronn

      IBM T. J. Watson Research Center, IBM TJ Watson Research Center, IBM, IBM T J Watson Res Ctr

    Authors

    • Nicholas Bronn

      IBM T. J. Watson Research Center, IBM TJ Watson Research Center, IBM, IBM T J Watson Res Ctr

    • Vivekananda Adiga

      IBM TJ Watson Research Center, IBM

    • Salvatore Olivadese

      IBM TJ Watson, IBM TJ Watson Research Center, IBM, IBM T J Watson Res Ctr

    • Oblesh Jinka

      IBM TJ Watson Research Center, IBM T J Watson Res Ctr

    • Xian Wu

      NIST - Boulder, National Institute of Standards and Technology

    • Jerry Chow

      IBM T.J. Watson Research Center, IBM T. J. Watson Research Center, IBM TJ Watson, IBM TJ Watson Research Center, IBM, IBM T J Watson Res Ctr, IBM T J Watson Research Center

    • David Pappas

      NIST, National Institute of Standards and Technology, NIST - Boulder

    View abstract →

  • 3D Integration for Superconducting Qubits: Part 1

    ORAL

    –

    Presenters

    • Danna Rosenberg

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    Authors

    • Danna Rosenberg

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Gregory Calusine

      MIT Lincoln Laboratory

    • Rabindra Das

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Alexandra Day

      MIT Lincoln Laboratory

    • Evan Golden

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Amy Greene

      Massachusetts Inst of Tech-MIT, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT

    • Simon Gustavsson

      Massachusetts Institute of Technology, Research Laborotary of Electronics, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT, MIT, Research Laboratory of Electronics, Massachusetts institute of Technology

    • Philip Krantz

      Microtechnology and nanoscience, Chalmers University of Technology, Research Laborotary of Electronics, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT, Research Laboratory of Electronics, Massachusetts Institute of Technology

    • David Kim

      MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Morten Kjaergaard

      Massachusetts Inst of Tech-MIT, MIT

    • Justin Mallek

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

    • Alexander Melville

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Bethany Niedzielski

      MIT Lincoln Laboratory

    • Mollie Schwartz

      MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Steven Weber

      MIT Lincoln Laboratory

    • Wayne Woods

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Jonilyn Yoder

      Massachusetts Institute of Technology, MIT Lincoln Laboratory

    • Donna-Ruth Yost

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

    • Andrew Kerman

      MIT Lincoln Laboratory, Massachusetts Inst of Tech-MIT, MIT Lincoln Lab

    • William Oliver

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology & MIT Lincoln Laboratory, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT, MIT, Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology

    View abstract →

  • 3D Integration for Superconducting Qubits; Part 2 Superconducting Through Silicon Via Interposer Fabrication

    ORAL

    –

    Presenters

    • Donna-Ruth Yost

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

    Authors

    • Donna-Ruth Yost

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

    • Justin Mallek

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

    • Danna Rosenberg

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Philip Krantz

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT

    • Matthew Cook

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Rabindra Das

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Alexandra Day

      MIT Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Evan Golden

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • David Kim

      MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Alexander Melville

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Corey Stull

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Wayne Woods

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Jonilyn Yoder

      MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Andrew Kerman

      MIT Lincoln Laboratory, Massachusetts Inst of Tech-MIT, MIT Lincoln Lab

    • William Oliver

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology & MIT Lincoln Laboratory, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT, MIT, Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology

    View abstract →

  • Superconducting Through Silicon Vias (TSVs) for 3D Integration in Quantum Computing

    ORAL

    –

    Presenters

    • Justin Mallek

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

    Authors

    • Justin Mallek

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

    • Donna-Ruth Yost

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

    • Danna Rosenberg

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Philip Krantz

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT

    • Matthew Cook

      MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Rabindra Das

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Evan Golden

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • David Kim

      MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • Alexander Melville

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Corey Stull

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Wayne Woods

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

    • Jonilyn Yoder

      MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

    • William Oliver

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology & MIT Lincoln Laboratory, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT, MIT, Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology

    View abstract →