Interlayer Electron-Phonon Interaction and Phonon Chirality at Two-Dimensional Material/Silicon Dioxide Interface

ORAL

Abstract

In this work, we report the emerging phonon emissions arising from the strong electron-phonon interaction at the few-layer two-dimensional (2D) material/silicon dioxide (SiO2) interfaces. The new phonon modes, which are originally Raman silent, are robust at the interfaces with various 2D materials coupled to the surface of SiO2. We demonstrate that through electron-phonon coupling, the intrinsic properties of the electronic band structures in the coupled 2D materials are revealed by the novel chirality and in-plane anisotropy of the phonon modes. Our observations provide a deep insight into the microscopic mechanism of electron-phonon interaction at the interfaces between 2D materials and dielectrics.

Presenters

  • Chen Chen

    Department of Electrical Engineering, Yale University

Authors

  • Chen Chen

    Department of Electrical Engineering, Yale University

  • Xiaolong Chen

    Department of Electrical Engineering, Yale University, Department of Electrical Engineering, Yale Univ

  • Yuchuan Shao

    Department of Electrical Engineering, Yale University

  • Qiushi Guo

    Department of Electrical Engineering, Yale University, Department of Electrical Engineering, Yale Univ

  • Bingchen Deng

    Department of Electrical Engineering, Yale University, Department of Electrical Engineering, Yale Univ

  • Sung Min Lee

    Center for Correlated Electron Systems, Institute for Basic Science , Department of Physics and Astronomy, Seoul National University, Seoul Natl Univ

  • Chao Ma

    Department of Electrical Engineering, Yale University

  • Je-Guen Park

    Center for Correlated Electron Systems, Institute for Basic Science , Department of Physics and Astronomy, Seoul National University, Seoul Natl Univ, Department of Physics & Astronomy, Seoul National University, Physics, Seoul Natl Univ, Department of Physics and Astronomy, Seoul Natl Univ, Seoul National University

  • Shengxi Huang

    Department of Electrical Engineering, The Pennsylvania State University, University Park, EECS, MIT, Stanford University; Pennsylvania State University

  • Fengnian Xia

    Department of Electrical Engineering, Yale University, Department of Electrical Engineering, Yale Univ