Process Monitoring to Improve Reliability and Yield for Superconducting Circuits

ORAL

Abstract

As the scale and complexity of superconducting circuits increases, characterizing and monitoring the underlying processes will become increasingly important. MIT Lincoln Laboratory uses process control structures to characterize devices, track key parameters, and support the development of more complex designs. We will describe the development of software and database capabilities that allow us to visualize cross-wafer patterns, examine trends, and monitor process stability.

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Presenters

  • Alexandra Day

    MIT Lincoln Laboratory, Massachusetts Inst of Tech-MIT

Authors

  • Alexandra Day

    MIT Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Danna Rosenberg

    MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • David Kim

    MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Jonilyn Yoder

    MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • William Oliver

    MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology & MIT Lincoln Laboratory, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT, MIT, Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology