Electroplated Rhenium - A new high-enough Tc material8
ORAL
Abstract
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Presenters
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David Pappas
National Institute of Standards and Technology (NIST), Boulder, Quantum Devices, NIST-Boulder, National Institute of Standards and Technology Boulder, NIST, Boulder, Colorado, National Institute of Standards and Technology, Boulder
Authors
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David Pappas
National Institute of Standards and Technology (NIST), Boulder, Quantum Devices, NIST-Boulder, National Institute of Standards and Technology Boulder, NIST, Boulder, Colorado, National Institute of Standards and Technology, Boulder
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Russell Lake
National Institute of Standards and Technology (NIST), Boulder, Boulder, NIST, National Institute of Standards and Technology Boulder, National Institute of Standards and Technology, Boulder
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Mustafa Bal
Quantum Devices, NIST-Boulder, National Institute of Standards and Technology Boulder, National Institute of Standards and Technology, Boulder
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Corey Rae McRae
National Institute of Standards and Technology Boulder, National Institute of Standards and Technology, Boulder
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Ronald B Goldfarb
National Institute of Standards and Technology Boulder
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Donald David
CIRES, University of Colorado
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Junling Long
National Institute of Standards and Technology Boulder, National Institute of Standards and Technology, Boulder
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Britton L Plourde
Physics, Syracuse University, Syracuse University, Syracuse Univ, Department of Physics, Syracuse University
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Eunja Kim
Department of Physics and Astronomy, University of Nevada, Las Vegas, Department of Physics, University of Nevada Las Vegas
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Dustin A Hite
NIST, Boulder, Colorado, National Institute of Standards and Technology Boulder
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Lee Pappas
CIRES, University of Colorado
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Ilke Arslan
Center for Nanoscale Materials, Argonne National Laboratory, Argonne National Laboratory
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Xian Wu
Physical and Life Sciences Directorate, Lwarence Livermore National Laboratory, National Institute of Standards and Technology, Boulder, National Institute of Standards and Technology Boulder, Lawrence Livermore National Laboratory
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qiang huang
Department of Chemical and Biological Engineering, University of Alabama
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Hsiang-Sheng Ku
National Institute of Standards and Technology Boulder, National Institute of Standards and Technology, Boulder, Alibaba
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Alexana Roshko
National Institute of Standards and Technology Boulder
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Jianguo Wen
Center for Nanoscale Materials, Argonne National Laboratory, Argonne National Laboratory