Phonons and thermal transport in hafnium disulphide (HfS2)
ORAL
Abstract
Recent studies have shown that hafnium disulphide (HfS2) exhibits many desirable properties such as high room-temperature mobility, finite bandgap, and high on-off current ratio that are favored by electronic devices. Despite the large number of existing studies of HfS2, thermal transport properties have not been fully explored and the related question of how temperature affects the thermal properties remain unanswered.
In this work, we report anharmonic phonons in HfS2 via first-principle calculations. Key calculated properties include the fully anisotropic Gruneissen parameters, specific heats, coefficients of thermal expansion, and anisotropic thermal conductivity. The study of thermal expansion found interesting behaviors that suggest the structure of HfS2 gives rise to negative Gruneissen parameters where the frequency or energy of a mode can decrease with applied pressure. The associated phonon lifetimes and specific heats also are used to examine mode contributions to the anisotropic thermal conductivity. Our results also confirm that the overall out-of-plane thermal conductivity of HfS2 is small, on the order of 1 W/mK, suggesting the promise of HfS2 application to thermoelectric devices.
In this work, we report anharmonic phonons in HfS2 via first-principle calculations. Key calculated properties include the fully anisotropic Gruneissen parameters, specific heats, coefficients of thermal expansion, and anisotropic thermal conductivity. The study of thermal expansion found interesting behaviors that suggest the structure of HfS2 gives rise to negative Gruneissen parameters where the frequency or energy of a mode can decrease with applied pressure. The associated phonon lifetimes and specific heats also are used to examine mode contributions to the anisotropic thermal conductivity. Our results also confirm that the overall out-of-plane thermal conductivity of HfS2 is small, on the order of 1 W/mK, suggesting the promise of HfS2 application to thermoelectric devices.
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Presenters
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Jie Peng
Mechanical Engineering, University of Maryland, College Park
Authors
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Jie Peng
Mechanical Engineering, University of Maryland, College Park
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Peter Chung
University of Maryland, College Park, Mechanical Engineering, University of Maryland, College Park
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Sina Najmaei
Sensors and Electron Devices Directorate, United States Army Research Laboratory
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Madan Dubey
Sensors and Electron Devices Directorate, United States Army Research Laboratory