Atomic Structure and Nano-Fracture Mechanics of Semiconductor-Oxide Interfaces Investigated by Transmission Electron Microscopy and Scanning Force Microscopy
ORAL
Abstract
Quantitative Information on interface adhesion and fracture resistance is of importance for electronic and MEMS/NEWS device manufacturing. Here we focus on Scanning Force Microscopy derived methods [1] which reveal the mechanical properties and fracture thresholds of oxide with respect to semiconductor interfaces like SiO2/Si and SiO2/SiC. Load/unload cycles i.e. force vs. distance curves reflect the effect of structural defects on interface strength under the influence of fluids solubilising and modifying surface/ interface layers [2]. Nanomechanic properties can be assessed at different time scales. Interface defects are characterized by complementary Microscopic and Spectroscopic Nanoanalysis using STEM and HR-TEM.
[1] Elastic modulus and fracture strength evaluation on the nanoscale by scanning force microscope experiments D M Jarzabek, et al., Nanotechnology (2014) DOI:10.1088/0957-4484/25/21/215701
[2] Influence of Alkali Ions on Tribological Properties of Silicon Surface, D M Jarzabek, et al., Tribol Lett (2015) DOI 10.1007/s11249-015-0603-5
[1] Elastic modulus and fracture strength evaluation on the nanoscale by scanning force microscope experiments D M Jarzabek, et al., Nanotechnology (2014) DOI:10.1088/0957-4484/25/21/215701
[2] Influence of Alkali Ions on Tribological Properties of Silicon Surface, D M Jarzabek, et al., Tribol Lett (2015) DOI 10.1007/s11249-015-0603-5
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Presenters
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Dipanwita Dutta
Paul Scherrer Institute
Authors
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Dipanwita Dutta
Paul Scherrer Institute
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Dariusz Jarzabek
Mechanics of Materials, Institute of Fundamental Technological Research, Polish Academy of Sciences
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Helmut Schift
Paul Scherrer Institute
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Zygmunt Rymuza
Micromechanics and Photonics, Warszaw University of Technology
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Thomas Jung
Paul scherrer institute, Paul Scherrer Institute