Simple and Re-useable Flip-Chip Method for Hybrid Quantum Sytems

ORAL

Abstract

The flexibility and scalability of solid-state qubit systems can be greatly improved with the use of flip-chip geometries, as these provide a third dimension for interconnects and allow coupling of systems on different substrates [1,2]. Indium bump-bonded flip-chips can be prohibitively costly for a university lab, and do not offer a means to re-use the substrates. Here, we describe a simple, low cost, non-galvanic approach to flip-chip bonding, demonstrated using superconducting qubits coupled to other quantum systems, including acoustic and electromagnetic resonators. We achieve less than two microns of placement error, and provide a cryogenically-compatible bonded structure that can be disassembled using acetone. We have tested the approach using inductively coupled coplanar waveguide resonators, and we have designed a multi-qubit experiment with direct inductive coupling between qubits on separate substrates.

[1] Rosenberg, D. et al. npj Quantum Information 3, 42 (2017).
[2] Satzinger, K. J. et al. arXiv:1804.07308

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Presenters

  • Christopher Conner

    University of Chicago, Institute for Molecular Engineering, University of Chicago

Authors

  • Christopher Conner

    University of Chicago, Institute for Molecular Engineering, University of Chicago

  • Kevin Satzinger

    Physics, University of California, Santa Barbara, University of California, Santa Barbara, Department of Physics, University of California, Santa Barbara, Department of Physics, Univerity of California, Santa Barbara, UC Santa Barbara; University of Chicago, Google Inc - Santa Barbara

  • Youpeng Zhong

    University of Chicago, Institute for Molecular Engineering, University of Chicago

  • Hung-Shen Chang

    University of Chicago, Institute for Molecular Engineering, University of Chicago

  • Gregory A Peairs

    University of Chicago, Physics, University of California, Santa Barbara, University of California, Santa Barbara, Department of Physics, University of California, Santa Barbara, Department of Physics, Univerity of California, Santa Barbara, UC Santa Barbara; University of Chicago

  • Audrey Bienfait

    Institute for Molecular Engineering, University of Chicago, University of Chicago

  • Ming-Han Chou

    University of Chicago, Institute for Molecular Engineering, University of Chicago

  • Agnetta Cleland

    Institute for Molecular Engineering, University of Chicago

  • Etienne Dumur

    University of Chicago, Institute for Molecular Engineering, University of Chicago

  • Joel Grebel

    University of Chicago, Institute for Molecular Engineering, University of Chicago

  • Rhys G Povey

    University of Chicago, Institute for Molecular Engineering, University of Chicago

  • Samuel Whiteley

    University of Chicago, Institute for Molecular Engineering and Department of Physics, University of Chicago, Institute for Molecular Engineering, University of Chicago

  • David Awschalom

    University of Chicago, Institute for Molecular Engineering, University of Chicago

  • David Schuster

    University of Chicago, The University of Chicago, Physics, University of Chicago, Department of Physics, University of Chicago

  • Andrew N Cleland

    University of Chicago, Institute for Molecular Engineering, University of Chicago