3D Integration for Superconducting Qubits
FOCUS · S35
Presentations
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Multilayer coaxial superconducting circuits with integrated 3D wiring
Invited
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Presenters
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Peter Leek
Condensed Matter Physics, University of Oxford, University of Oxford
Authors
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Peter Leek
Condensed Matter Physics, University of Oxford, University of Oxford
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Flux Tunable Superconductings Qubits With 3D Wiring
ORAL
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Presenters
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Jeremy Bejanin
Physics & IQC, University of Waterloo
Authors
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Jeremy Bejanin
Physics & IQC, University of Waterloo
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Carolyn Earnest
Physics & IQC, University of Waterloo
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Thomas G McConkey
Electrical And Computer Engineering & IQC, University of Waterloo
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Evan Peters
Physics & IQC, University of Waterloo
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Matteo Mariantoni
Physics & IQC, University of Waterloo
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Increasing reliability for 3D integrated high-coherence superconducting qubits
ORAL
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Presenters
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Bethany M Niedzielski
Michigan State University, MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology
Authors
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Bethany M Niedzielski
Michigan State University, MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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David K Kim
MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Jonilyn L Yoder
MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Danna Rosenberg
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Mollie E. Schwartz
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Rabindra Das
MIT Lincoln Laboratory
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Alexander Melville
MIT Lincoln Lab, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Donna-Ruth Yost
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Justin Mallek
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Alexandra L Day
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Steven Weber
MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology
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Cyrus F. Hirjibehedin
MIT Lincoln Laboratory, London Centre for Nanotechnology, University College London
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William D Oliver
Research Laboratory of Electronics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Physics, Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Physics, Massachusetts Institute of Technology, Dept. of Physics, Research Laboratory of Electronics, and Lincoln Lab, Massachusetts Institute of Technology, USA, Research Laboratory of Electronics, Department of Physics, Massachusetts Institute of Technology, Cambridge, MA 02139, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, Massachusetts Institute of Technology and MIT Lincoln Laboratory, Research Laboratory of Electronics, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, MIT; Research Laboratory of Electronics, MIT; MIT Lincoln Laboratory
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3D-wired coaxial circuit QED I: Extension to multi-qubit devices
ORAL
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Presenters
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Salha Jebari
University of Oxford, Condensed Matter Physics, University of Oxford
Authors
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Salha Jebari
University of Oxford, Condensed Matter Physics, University of Oxford
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Joseph Rahamim
Condensed Matter Physics, University of Oxford, University of Oxford
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Andrew D Patterson
Condensed Matter Physics, University of Oxford, University of Oxford
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Peter A Spring
Condensed Matter Physics, University of Oxford
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Takahiro Tsunoda
Condensed Matter Physics, University of Oxford
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Sophia Sosnina
Condensed Matter Physics, University of Oxford
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Martina Esposito
Condensed Matter Physics, University of Oxford, University of Oxford
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Kitti Ratter
Condensed Matter Physics, University of Oxford
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Giovanna Tancredi
Condensed Matter Physics, University of Oxford
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Brian Vlastakis
Condensed Matter Physics, University of Oxford
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Peter Leek
Condensed Matter Physics, University of Oxford, University of Oxford
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3D-wired coaxial circuit QED II: Evaluation of crosstalk
ORAL
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Presenters
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Joseph Rahamim
Condensed Matter Physics, University of Oxford, University of Oxford
Authors
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Joseph Rahamim
Condensed Matter Physics, University of Oxford, University of Oxford
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Salha Jebari
University of Oxford, Condensed Matter Physics, University of Oxford
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Andrew D Patterson
Condensed Matter Physics, University of Oxford, University of Oxford
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Peter A Spring
Condensed Matter Physics, University of Oxford
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Takahiro Tsunoda
Condensed Matter Physics, University of Oxford
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Sophia Sosnina
Condensed Matter Physics, University of Oxford
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Martina Esposito
Condensed Matter Physics, University of Oxford, University of Oxford
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Kitti Ratter
Condensed Matter Physics, University of Oxford
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Giovanna Tancredi
Condensed Matter Physics, University of Oxford
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Brian Vlastakis
Condensed Matter Physics, University of Oxford
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Peter Leek
Condensed Matter Physics, University of Oxford, University of Oxford
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Superconducting Qubits Integrated with Superconducting Through-Substrate Vias (TSVs): Fabrication
ORAL
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Presenters
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Donna-Ruth Yost
MIT Lincoln Laboratory, Massachusetts Institute of Technology
Authors
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Donna-Ruth Yost
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Mollie E. Schwartz
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Danna Rosenberg
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Justin Mallek
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Rabindra Das
Massachusetts Institute of Technology
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Alexandra L Day
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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David K Kim
MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Bethany M. Niedzielski
Massachusetts Institute of Technology, MIT Lincoln Laboratory, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421
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Alexander Melville
MIT Lincoln Lab, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Wayne Woods
MIT Lincoln Lab, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Jonilyn L Yoder
MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Andrew James Kerman
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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William D Oliver
Research Laboratory of Electronics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Physics, Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Physics, Massachusetts Institute of Technology, Dept. of Physics, Research Laboratory of Electronics, and Lincoln Lab, Massachusetts Institute of Technology, USA, Research Laboratory of Electronics, Department of Physics, Massachusetts Institute of Technology, Cambridge, MA 02139, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, Massachusetts Institute of Technology and MIT Lincoln Laboratory, Research Laboratory of Electronics, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, MIT; Research Laboratory of Electronics, MIT; MIT Lincoln Laboratory
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Superconducting qubits integrated with superconducting through-substrate vias: Measurement
ORAL
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Presenters
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Mollie E. Schwartz
MIT Lincoln Laboratory, Massachusetts Institute of Technology
Authors
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Mollie E. Schwartz
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Donna-Ruth Yost
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Danna Rosenberg
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Justin Mallek
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Rabindra Das
MIT Lincoln Laboratory
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Alexandra L Day
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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David K Kim
MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Alexander Melville
MIT Lincoln Lab, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Bethany M Niedzielski
Michigan State University, MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Jonilyn L Yoder
MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Andrew James Kerman
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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William D Oliver
Research Laboratory of Electronics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Physics, Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Physics, Massachusetts Institute of Technology, Dept. of Physics, Research Laboratory of Electronics, and Lincoln Lab, Massachusetts Institute of Technology, USA, Research Laboratory of Electronics, Department of Physics, Massachusetts Institute of Technology, Cambridge, MA 02139, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, Massachusetts Institute of Technology and MIT Lincoln Laboratory, Research Laboratory of Electronics, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, MIT; Research Laboratory of Electronics, MIT; MIT Lincoln Laboratory
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Multilayer Microwave Integrated Quantum Circuits: Part 1
ORAL
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Presenters
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Chan U Lei
Yale Univ, Yale University
Authors
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Chan U Lei
Yale Univ, Yale University
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Lev Krayzman
Yale Univ, Yale University
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Suhas Ganjam
Yale Univ, Yale University
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Teresa L Brecht
Yale Univ, HRL Laboratories, Yale University & HRL
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Christopher J Axline
Yale Univ, Yale Univ, ETH Zurich, Yale University & ETH, ETH Zurich
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Yiwen Chu
Yale Univ, Yale University
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Luke Burkhart
Yale Univ, Yale University
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Luigi Frunzio
Applied Physics, Yale University, Yale Univ, Yale University
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Robert J Schoelkopf
Yale Univ, Yale University, Department of Applied Physics and Physics, Yale University, Applied Physics, Yale University
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Multilayer Microwave Integrated Quantum Circuits: Part 2
ORAL
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Presenters
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Lev Krayzman
Yale Univ, Yale University
Authors
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Lev Krayzman
Yale Univ, Yale University
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Chan U Lei
Yale Univ, Yale University
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Suhas Ganjam
Yale Univ, Yale University
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Teresa L Brecht
Yale Univ, HRL Laboratories, Yale University & HRL
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Christopher J Axline
Yale Univ, Yale Univ, ETH Zurich, Yale University & ETH, ETH Zurich
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Yiwen Chu
Yale Univ, Yale University
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Luigi Frunzio
Applied Physics, Yale University, Yale Univ, Yale University
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Robert J Schoelkopf
Yale Univ, Yale University, Department of Applied Physics and Physics, Yale University, Applied Physics, Yale University
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Development of superconducting connection by flip-chip bonding for a multilayer superconducting quantum annealing machine
ORAL
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Presenters
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Kazumasa Makise
National Institute of Advanced Industrial Science and Technology, National Institute of Advanced Industrial Science and Technology (AIST)
Authors
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Kazumasa Makise
National Institute of Advanced Industrial Science and Technology, National Institute of Advanced Industrial Science and Technology (AIST)
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Masaaki Maezawa
National Institute of Advanced Industrial Science and Technology (AIST)
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Mutsuo Hidaka
National Institute of Advanced Industrial Science and Technology, National Institute of Advanced Industrial Science and Technology (AIST)
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Hiroshi Nakagawa
National Institute of Advanced Industrial Science and Technology (AIST)
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Katsuya Kikuchi
National Institute of Advanced Industrial Science and Technology (AIST)
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Shiro Kawabata
National Institute of Advanced Industrial Science and Technology, National Institute of Advanced Industrial Science and Technology (AIST), Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology, Nanoelectronics Research Institute, National Institute of Advanced Industrial Science & Technology
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Intel Superconducting Qubits, Part 1: Performance improvements towards enabling quantum applications
ORAL
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Presenters
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Roman Caudillo
Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
Authors
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Roman Caudillo
Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
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David Michalak
Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
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Lester Lampert
Components Research, Intel, Components Research, Intel Corporation, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
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Adel A Elsherbini
Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
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Javier A Falcon
DATD, Intel
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Ye Seul Ashley Nam
DATD, Intel
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Preston T Myers
DATD, Intel
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Sonika Johri
Intel Labs, Intel, Intel
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Xiang Chris Zou
Intel Labs, Intel
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Jeanette Marie Roberts
Components Research, Intel, Components Research, Intel Corporation
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Alessandro Bruno
QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands
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Nandini Muthusubramanian
QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands, QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology
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Cornelis Christiaan Bultink
QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands
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Filip Malinowski
Delft University of Technology, University of Copenhagen, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Center for Quantum Devices, Niels Bohr Institute, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands
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Nadia Haider
QuTech and TNO, QuTech and Netherlands Organisation for Scientific Research (TNO), Delft, The Netherlands
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Leonardo DiCarlo
QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands, QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology
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Jim Clarke
Components Research, Intel, Components Research, Intel Corporation, Intel, Intel Corporation, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
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Intel Superconducting Qubits, Part 2: Integration on through-silicon-via (TSV) substrates.
ORAL
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Presenters
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David Michalak
Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
Authors
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David Michalak
Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
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Roman Caudillo
Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
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Lester Lampert
Components Research, Intel, Components Research, Intel Corporation, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
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Adel A Elsherbini
Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
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Javier A Falcon
DATD, Intel
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Ye Seul Ashley Nam
DATD, Intel
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Preston T Myers
DATD, Intel
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Jeanette Marie Roberts
Components Research, Intel, Components Research, Intel Corporation
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Alessandro Bruno
QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands
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Nandini Muthusubramanian
QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands, QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology
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Cornelis Christiaan Bultink
QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands
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Filip Malinowski
Delft University of Technology, University of Copenhagen, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Center for Quantum Devices, Niels Bohr Institute, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands
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Nadia Haider
QuTech and TNO, QuTech and Netherlands Organisation for Scientific Research (TNO), Delft, The Netherlands
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Leonardo DiCarlo
QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands, QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology
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Jim Clarke
Components Research, Intel, Components Research, Intel Corporation, Intel, Intel Corporation, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA
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3D Integration of Superconducting Qubits in a Three-Tiered Quantum Processor
ORAL
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Presenters
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Justin Mallek
MIT Lincoln Laboratory, Massachusetts Institute of Technology
Authors
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Justin Mallek
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Donna-Ruth Yost
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Rabindra Das
MIT Lincoln Laboratory
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Danna Rosenberg
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Vladimir Bolkhovsky
MIT Lincoln Laboratory
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Greg Calusine
MIT Lincoln Lab, MIT Lincoln Laboratory
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Matthew Cook
MIT Lincoln Laboratory
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Evan Golden
MIT Lincoln Lab, MIT Lincoln Laboratory
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David K Kim
MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Alexander Melville
MIT Lincoln Lab, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Bethany M Niedzielski
Michigan State University, MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Mollie E. Schwartz
MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Corey Stull
MIT Lincoln Laboratory
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Sergey Tolpygo
MIT Lincoln Laboratory
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Wayne Woods
MIT Lincoln Lab, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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Jonilyn L Yoder
MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology
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William D Oliver
Research Laboratory of Electronics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Physics, Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Physics, Massachusetts Institute of Technology, Dept. of Physics, Research Laboratory of Electronics, and Lincoln Lab, Massachusetts Institute of Technology, USA, Research Laboratory of Electronics, Department of Physics, Massachusetts Institute of Technology, Cambridge, MA 02139, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, Massachusetts Institute of Technology and MIT Lincoln Laboratory, Research Laboratory of Electronics, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, MIT; Research Laboratory of Electronics, MIT; MIT Lincoln Laboratory
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