Highly-Mobile Nanoparticles that Strongly Interact with Well-Entangled Polymer Melts Diffuse via the Vehicular Mechanism

ORAL

Abstract

When particles are large relative to the entanglement mesh in well-entangled polymer melts, the Stokes-Einstein (SE) relation predicts that particle diffusion scales as M-3.4. Using Rutherford backscattering spectrometry, we measure the diffusion coefficient of very small (radius ≈ 0.9 nm) octaaminophenyl silsesquioxane nanoparticles (NPs) in well-entangled poly(2-vinylpyridine) (P2VP) melts of varying molecular weight (1 – 26 entanglements/chain). We demonstrate that these small NPs diffuse between 10–10,000X faster in P2VP melts than predicted by SE, with the diffusion coefficients scaling weakly with molecular weight M–0.7±0.1. Furthermore, we characterize the local segmental relaxation process and chain-scale center-of-mass diffusion and find reductions relative to bulk of ~80% and ~60%, respectively, at a NP concentration of up to 25 vol%. Through the combined study of NP and polymer dynamics in this attractive nanocomposite system, we demonstrate experimentally that small and highly-mobile nanoparticles in well-entangled polymer melts diffuse via the vehicular mechanism, i.e. successive NP adsorption/desorption events that occur on Rouse length and time scales.

Presenters

  • Karen Winey

    University of Pennsylvania, Department of Materials Science and Engineering, University of Pennsylvania, U.S., Materials Science and Engineering, University of Pennsylvania, Dept of Materials Science and Engineering, University of Pennsylvania

Authors

  • Karen Winey

    University of Pennsylvania, Department of Materials Science and Engineering, University of Pennsylvania, U.S., Materials Science and Engineering, University of Pennsylvania, Dept of Materials Science and Engineering, University of Pennsylvania

  • Eric Bailey

    University of Pennsylvania, Materials Science and Engineering, University of Pennsylvania

  • Philip J Griffin

    University of Chicago

  • Russell John Composto

    University of Pennsylvania, Materials Science and Engineering, University of Pennsylvania