Integrated Device gets a Little Cooler based on Quantum Materials

Micro-thermoelectric modules are of potential use in fields such as energy harvesting, thermal management, thermal imaging and high spatial-resolution temperature sensing. In particular, micro-thermoelectric coolers (μ-TECs) – in which the application of an electric current cools the device based on the Peltier effect – can be used to manage heat locally on a micrometer spot in microelectronic circuits, optoelectronic devices and microfluidic channels. However, a cost-effective μ-TEC device that is compatible with the modern semiconductor fabrication industry has been developed. N-type BiTeSe and p-type pure Te were electrochemically deposited at room temperature into microstructured photoresist patterns. A comprehensive study the electrochemically synthesis if thermoelectric chalcogenide materials is presented [1]. The material quality is every high, that even fundamental aspect like topological surface states can be demonstrated in these chalcogenide film by transport measurements.
The final device performance of μ-TECs in terms of transient responses, cycling reliability and cooling stability has not been adequately assessed. Here we report the fabrication of μ-TECs that offer a rapid response time of 1 ms, reliability of up to 10 million cycles and a cooling stability of more than one month at constant electric current. The high cooling reliability and stability for our μ-TEC module [2] can be attributed to a design of free-standing top contacts between the thermoelectric legs and metallic bridges, which reduces the thermomechanical stress in the devices.

Ref:
[1] Ch. Schumacher at al., Advanced Energy Mater. 3, 95 (2013).
[2] G. Li et al Nature Electronics 1, 555 (2018).