Thermal transport and thermoelectric effects at solid-melt interfaces in semiconductors: Underlying physical phenomena that give rise to Thomson heat in semiconductors
ORAL
Abstract
1G. Bakan, N. Khan, H. Silva, A. Gokirmak, “High-temperature thermoelectric transport at small scales: generation, transport and recombination of minority carriers,” Nature Publications, Scientific Reports 3, 2724, doi:10.1038/srep02724 (2013).
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Presenters
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Ali Gokirmak
Electrical and Computer Engineering, University of Connecticut, Storrs, CT 06269, USA, University of Connecticut, ECE, UConn, Electrical and Computer Engineering, University of Connecticut
Authors
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Sadid Muneer
Electrical and Computer Engineering, University of Connecticut, Storrs, CT 06269, USA, University of Connecticut
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Gokhan Bakan
Electrical and Electronics Engineering, Atilim University, Ankara, Turkey
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Nathan Henry
Electrical and Computer Engineering, University of Connecticut, Storrs, CT 06269, USA
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Helena Silva
Electrical and Computer Engineering, University of Connecticut, Storrs, CT 06269, USA, University of Connecticut, ECE, UConn
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Ali Gokirmak
Electrical and Computer Engineering, University of Connecticut, Storrs, CT 06269, USA, University of Connecticut, ECE, UConn, Electrical and Computer Engineering, University of Connecticut