Revealing Proximity Effects at Magnetic Topological Insulator / Antiferromaget Interfaces

ORAL

Abstract

Magnetic topological insulators are an exciting new platform for the investigation of exciting time-reversal symmetry-breaking physics such as the quantum anomalous hall effect, inverse spin galvanic effect, axion electrodynamics, and spin orbit torque. These materials systems also have great potential for spintronic device applications, but practical development has so far been inhibited by the extremely low (around 30 K) Curie temperature of these materials. Interfacial proximity coupling to other magnetically ordered compounds has been suggested as a mechanism by which this challenge may be addressed. However, separating interfacial exchange coupling from less-desirable effects such as intermixing presents significant challenges. In this work, we use neutron and magnetic X-ray spectroscopy to assemble an depth and element-resolved picture of magnetism within topological insulator/antiferromagnet heterostructures. Our results support true proximity-induced magnetization in (Bi,Sb)2Te3 films interfaced with CrSb and MnTe, with enhanced ordering temperature and chiral magnetic structures. We show that the topology and magnetism of the (Bi,Sb)2Te3 may be readily controlled through exchange coupling with the adjacent antiferromagnet.

–

Presenters

  • Alexander Grutter

    National Institute of Standards and Technology, NIST, NIST Center for Neutron Research, NIST Gaithersburg, Neutron-Condensed Matter Science Group, NIST, NIST Center for Neutron Research

Authors

  • Alexander Grutter

    National Institute of Standards and Technology, NIST, NIST Center for Neutron Research, NIST Gaithersburg, Neutron-Condensed Matter Science Group, NIST, NIST Center for Neutron Research

  • Qing Lin He

    International Center for Quantum Materials, Peking University

  • Gen Yin

    Electrical Engineering, University of California, Los Angeles, Electrical and Computer Engineering, University of California, Los Angeles

  • Lei Pan

    Electrical Engineering, University of California, Los Angeles, University of California, Los Angeles, University of California Los Angeles, Department of Electrical Engineering, University of California, Los Angeles, Electrical and Computer Engineering Department, University of California, Los Angeles

  • Chao-Yao Yang

    Electrical Engineering, University of California, Los Angeles

  • Xiaoyu Che

    Electrical Engineering, University of California, Los Angeles, ECE, UCLA, Electrical and Computer Engineering Department, University of California, Los Angeles

  • Dustin Gilbert

    National Institute of Standards and Technology, NIST Center for Neutron Research, NIST Gaithersburg, Department of Materials Engineering, University of Tennesse, Knoxville

  • Steven Disseler

    National Institute of Standards and Technology, Northrop Grumman - Mission Systems, Northrop Grumman

  • Brian Kirby

    National Institute of Standards and Technology, NIST Center for Neutron Research, National Institute for Standards and Technology, NIST Center for Neutron Research

  • Julie Borchers

    National Institute of Standards and Technology, NIST Center for Neutron Research, National Institute of Standards and Technology

  • William Ratcliff

    NIST Center for Neutron Research, National Institute of Standards and Technology, National Institute of Standards and Technology, NIST Center for neutron research, National Institute of Standard and Technology, Gaithersburg, MD, NIST

  • Padraic Shafer

    Advanced Light Source, Lawrence Berkeley National Laboratory, Lawrence Berkeley National Laboratory, Advanced Light Source

  • Elke Arenholz

    Advanced Light Source, Lawrence Berkeley National Laboratory, Lawrence Berkeley National Laboratory, Advanced Light Source

  • Luyan Yu

    Electrical Engineering, University of California, Los Angeles

  • Guoqiang Yu

    Electrical Engineering, University of California, Los Angeles, Chinese Academy of Sciences, ECE, UCLA

  • Qiming Shao

    Electrical Engineering, University of California, Los Angeles, Electrical and Computer Engineering, University of California, Los Angeles, ECE, UCLA, University of California, Los Angeles, Electrical and Computer Engineering Department, University of California, Los Angeles, Department of Electrical Engineering, University of California, Los Angeles

  • Yingying Wu

    Electrical Engineering, University of California, Los Angeles, University of California, Los Angeles

  • Bin Zhang

    Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology

  • Xiaodong Han

    Beijing Key Lab of Microstructure and Property of Advanced Materials, Beijing University of Technology

  • Yizhou Liu

    Electrical and Computer Engineering, University of California, Riverside, Department of Electrical and Computer Engineering, University of California, Riverside

  • Roger Lake

    Electrical and Computer Engineering, University of California, Riverside, University of California, Riverside, Department of Electrical and Computer Engineering, University of California, Riverside

  • Kam Tuen Law

    Physics, Hong Kong University of Science and Technology, Department of Physics, Hong Kong University of Science and Technology, Physics, HKUST, Hong Kong University of Science and Technology, The Hong Kong University of Science and Technology

  • Kang Wang

    Electrical Engineering, University of California, Los Angeles