Morphology of copper using lateral electrodeposition suitable for low-temperature soldering of microelectronic devices

Lateral copper growth for the development of electroplating technique as a low-temperature soldering procedure allows modification of the morphology and properties of soldering joints. The approach is particularly useful for soldering electronic components to a plastic 3D printed substrate and printed circuit boards(PCBs). Miniaturization of PCBs has shown an improvement in the efficiency and properties of electronic devices leading to new applications. An electrode pattern was used with a separation gap of 1mm. A junction between the two working electrodes was reported to occur in less than 1 minute, this result ensures the participation of the electrolyte. Hydrogen bubbles released after the electrolysis caused the structure of the electroplated layer to be more porous suitable for sensors and other applications. The morphology of copper deposits based on the interaction with hydrogen was exanimated using Scanning Electron Microscopy (SEM) technique. Further experiments are required to optimize the soldering process for 3D approaches allowing interconnections of microelectronic devices.