Energy Approach to Understand Contact Mechanics on Rough Surfaces
ORAL
Abstract
Understanding the deformation of elastic solids on rough surfaces is crucial for soft-hard contacts at different scales of applications such as biomedical adhesives, tire traction, soft robotics and even micro- or nano-electromechanical devices. It has been experimentally demonstrated that the apparent work of adhesion for a soft material brought in contact with rough surfaces is lower than the intrinsic work of adhesion. During separation, there is energy loss commonly attributed to viscoelastic dissipation, termed as adhesion hysteresis. Here, with
experimentally controlled elastic modulus, roughness and surface chemistry, we demonstrate that the reduction in work of adhesion is equal to the energy required to achieve conformal contact. Further, the energy loss during contact and removal is equal to the product of the
intrinsic work of adhesion and the true contact area. These findings provide a simple mechanism to quantitatively link the widely observed adhesion hysteresis to roughness rather than viscoelastic dissipation.
experimentally controlled elastic modulus, roughness and surface chemistry, we demonstrate that the reduction in work of adhesion is equal to the energy required to achieve conformal contact. Further, the energy loss during contact and removal is equal to the product of the
intrinsic work of adhesion and the true contact area. These findings provide a simple mechanism to quantitatively link the widely observed adhesion hysteresis to roughness rather than viscoelastic dissipation.
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Presenters
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Siddhesh Dalvi
Univ of Akron
Authors
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Siddhesh Dalvi
Univ of Akron
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Abhijeet Gujrati
Mechanical Engineering and Material Science, University of Pittsburgh
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Tevis D.B. Jacobs
Department of Mechanical Engineering and Materials Science, University of Pittsburgh, Mechanical Engineering and Material Science, University of Pittsburgh
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Lars Pastewka
Department of Microsystem Engineering, University of Freiburg, Microsystems Engineering, University of Freiburg, Departement of Microsystems Engineering, University Freiburg
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Ali N Dhinojwala
Polymer Science, The University of Akron, Univ of Akron