3D Integration to Enable High Coherence and Connectivity for Superconducting Qubits
Invited
Abstract
As superconducting qubit systems gets larger, it will become increasingly important to use 3D integration to address arrays of qubits. I will present our work developing and characterizing 3D integration components, focusing on superconducting through-silicon vias (TSVs), and I will discuss recent demonstrations incorporating superconducting TSVs in qubit control and readout circuitry.
This research was funded by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and by the Assistant Secretary of Defense for Research & Engineering under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of ODNI, IARPA, or the US Government.
This research was funded by the Office of the Director of National Intelligence (ODNI), Intelligence Advanced Research Projects Activity (IARPA) and by the Assistant Secretary of Defense for Research & Engineering under Air Force Contract No. FA8721-05-C-0002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements, either expressed or implied, of ODNI, IARPA, or the US Government.
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Presenters
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Danna Rosenberg
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology
Authors
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Danna Rosenberg
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology