Superconducting Qubits: 3D Integration and Cryogenic Packaging

ORAL · X16 · ID: 353119






Presentations

  • Scalable packaging for superconducting qubits with vertical wiring

    ORAL

    Presenters

    • Shuhei Tamate

      Research Center for Advanced Science and Technology, The University of Tokyo, The University of Tokyo

    Authors

    • Shuhei Tamate

      Research Center for Advanced Science and Technology, The University of Tokyo, The University of Tokyo

    • Yutaka Tabuchi

      Research Center for Advanced Science and Technology, The University of Tokyo, The University of Tokyo

    • Laszlo Szikszai

      Center for Emergent Matter Science, RIKEN

    • Koichi Kusuyama

      Center for Emergent Matter Science, RIKEN

    • Kun Zuo

      Center for Emergent Matter Science, RIKEN, RIKEN, Center for Emergent Matter Science (CEMS), RIKEN

    • Yuji Hishida

      National Institute of Information and Communications Technology

    • Wei Qiu

      National Institute of Information and Communications Technology, Advanced ICT research institute, NICT, Advanced ICT Research Institute, National Institute of Information and Communications Technology

    • Hirotaka Terai

      National Institute of Information and Communications Technology, Advanced ICT research institute, NICT, Advanced ICT Research Institute, National Institute of Information and Communications Technology

    • Masahiro Ukibe

      National Institute of Advanced Industrial Science and Technology

    • Go Fujii

      National Institute of Advanced Industrial Science and Technology

    • Kazumasa Makise

      National Institute of Advanced Industrial Science and Technology

    • Naoya Watanabe

      National Institute of Advanced Industrial Science and Technology

    • Katsuya Kikuchi

      National Institute of Advanced Industrial Science and Technology

    • Yasunobu Nakamura

      Research Center for Advanced Science and Technology, The University of Tokyo, Univ of Tokyo, RIKEN, RCAST, The University of Tokyo, The University of Tokyo

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  • Multilayer Microwave Integrated Quantum Circuits: Part 1

    ORAL

    Presenters

    • Chan U Lei

      Yale University

    Authors

    • Chan U Lei

      Yale University

    • Lev Krayzman

      Yale University

    • Suhas Ganjam

      Yale University

    • Luigi Frunzio

      Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University

    • Robert Schoelkopf

      Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University

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  • Multilayer Microwave Integrated Quantum Circuits: Part 2

    ORAL

    Presenters

    • Lev Krayzman

      Yale University

    Authors

    • Lev Krayzman

      Yale University

    • Chan U Lei

      Yale University

    • Suhas Ganjam

      Yale University

    • Luigi Frunzio

      Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University

    • Robert Schoelkopf

      Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University

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  • Multilayer Microwave Integrated Quantum Circuits: Part 3

    ORAL

    Presenters

    • Suhas Ganjam

      Yale University

    Authors

    • Suhas Ganjam

      Yale University

    • Chan U Lei

      Yale University

    • Lev Krayzman

      Yale University

    • Luigi Frunzio

      Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University

    • Robert Schoelkopf

      Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University

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  • Principles of Microwave Package Design for Superconducting Quantum Processors

    ORAL

    Presenters

    • Sihao Huang

      Department of Physics, Massachusetts Institute of Technology

    Authors

    • Sihao Huang

      Department of Physics, Massachusetts Institute of Technology

    • Benjamin Lienhard

      Research Laboratory of Electronics, Massachusetts Institute of Technology, Massachusetts Institute of Technology MIT

    • Bharath Kannan

      Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology (MIT)

    • Jochen Braumüller

      Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT

    • David K Kim

      MIT Lincoln Laboratory, MIT Lincoln Lab, MIT-Lincoln Lab, MIT Lincoln Laboratories, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    • Joel Wang

      Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Physics, MIT, Research Laboratory of Electronics, Massachusetts Institute of Technology (MIT)

    • Alexander Melville

      MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    • Bethany Niedzielski

      MIT Lincoln Laboratory

    • Jonilyn Yoder

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    • Terry Philip Orlando

      Electrical Engineering and Computer Science, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology (MIT)

    • Simon Gustavsson

      Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology (MIT)

    • William Oliver

      Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog

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  • 3D Integration with Protected Qubits

    ORAL

    Presenters

    • Anjali Premkumar

      Princeton University, Department of Electrical Engineering, Princeton University

    Authors

    • Anjali Premkumar

      Princeton University, Department of Electrical Engineering, Princeton University

    • Andras Gyenis

      Princeton University, Department of Electrical Engineering, Princeton University

    • Pranav Mundada

      Princeton University, Department of Electrical Engineering, Princeton University, Electrical Engineering, Princeton University

    • Andrew Houck

      Princeton University, Electrical Engineering, Princeton University, Department of Electrical Engineering, Princeton University

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  • Cryogenic Thermalization Measurements of Microwave Attenuators

    ORAL

    Presenters

    • Aniket Maiti

      Yale University

    Authors

    • Aniket Maiti

      Yale University

    • Vijay Jain

      Yale University

    • Luigi Frunzio

      Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University

    • Robert Schoelkopf

      Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University

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  • Dilution-equivalent solid-state chip refrigeration

    ORAL

    Presenters

    • Alberto Ronzani

      VTT Micro & Nanoelectronics, Aalto University

    Authors

    • Alberto Ronzani

      VTT Micro & Nanoelectronics, Aalto University

    • Janne Lehtinen

      VTT Micro & Nanoelectronics, VTT Technical Research Centre of Finland Ltd

    • Emma Mykkanen

      VTT Micro & Nanoelectronics

    • Antti Kemppinen

      VTT Micro & Nanoelectronics

    • Leif Grönberg

      VTT Micro & Nanoelectronics, VTT Technical Research Centre of Finland Ltd, QTF Center of Excellence, VTT Technical Research Centre of Finland, VTT Techical Research Center of Finland Ltd.

    • Antti Manninen

      VTT Micro & Nanoelectronics

    • Mika Prunnila

      VTT Micro & Nanoelectronics, VTT Technical Research Centre of Finland Ltd, Micro & Nanoelectronics, VTT Technical Research Centre of Finland, VTT Technical Research Centre of Finland

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  • Hot electron measurements below 100 mK for quantum devices

    ORAL

    Presenters

    • Zachary Steffen

      University of Maryland, College Park

    Authors

    • Zachary Steffen

      University of Maryland, College Park

    • Sudeep Dutta

      University of Maryland, College Park, University of Maryland College Park

    • Rui Zhang

      University of Maryland, College Park

    • Yizhou Huang

      University of Maryland, College Park

    • Kungang Li

      University of Maryland, College Park

    • Frederick C Wellstood

      University of Maryland, College Park, University of Maryland College Park

    • Benjamin Palmer

      University of Maryland, College Park, Laboratory of Physical Sciences

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  • Extending Superconducting Qubits Out of Plane (Part 1): Qubits with Air Bridge Crossovers in Multi-Tier Stacks

    ORAL

    Presenters

    • Jonilyn Yoder

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    Authors

    • Jonilyn Yoder

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    • Justin Mallek

      MIT Lincoln Laboratory

    • David K Kim

      MIT Lincoln Laboratory, MIT Lincoln Lab, MIT-Lincoln Lab, MIT Lincoln Laboratories, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    • Donna-Ruth Yost

      MIT Lincoln Laboratory

    • Greg Calusine

      MIT Lincoln Lab, MIT Lincoln Laboratory

    • Rabindra Das

      MIT Lincoln Laboratory, MIT Lincoln Laboratories

    • Alexandra Day

      MIT Lincoln Laboratory, Massachusetts Institute of Technology MIT

    • Alexander Melville

      MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    • Bethany M Niedzielski

      MIT Lincoln Laboratory

    • Danna Rosenberg

      MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology

    • Gabriel Orr Samach

      MIT Research Laboratory of Electronics, MIT Department of Electrical Engineering and Computer Science, MIT Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory

    • Mollie Schwartz

      MIT Lincoln Laboratory, MIT Lincoln Lab

    • Steven Weber

      MIT Lincoln Laboratory

    • William Oliver

      Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog

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  • Extending Superconducting Qubits Out of Plane (Part 2): Through-Silicon Vias

    ORAL

    Presenters

    • Justin Mallek

      MIT Lincoln Laboratory

    Authors

    • Justin Mallek

      MIT Lincoln Laboratory

    • Jonilyn Yoder

      MIT Lincoln Laboratory, MIT-Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), MIT Lincoln Lab

    • Donna-Ruth Yost

      MIT Lincoln Laboratory

    • Rabindra Das

      MIT Lincoln Laboratory, MIT Lincoln Laboratories

    • Alexandra Day

      MIT Lincoln Laboratory, Massachusetts Institute of Technology MIT

    • Danna Rosenberg

      MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology

    • Greg Calusine

      MIT Lincoln Lab, MIT Lincoln Laboratory

    • Matthew Cook

      MIT Lincoln Laboratory

    • Evan Golden

      MIT Lincoln Laboratory, Massachusetts Institute of Technology MIT

    • David K Kim

      MIT Lincoln Laboratory, MIT Lincoln Lab, MIT-Lincoln Lab, MIT Lincoln Laboratories, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    • Alexander Melville

      MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    • Bethany Niedzielski

      MIT Lincoln Laboratory

    • Mollie Schwartz

      MIT Lincoln Laboratory, MIT Lincoln Lab

    • Corey Stull

      MIT Lincoln Laboratory

    • Sergey Tolpygo

      MIT Lincoln Laboratory

    • Wayne Woods

      MIT Lincoln Lab, MIT Lincoln Laboratory

    • William Oliver

      Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog

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  • Quantifying Losses in Transmon Qubits

    ORAL

    Presenters

    • Greg Calusine

      MIT Lincoln Lab, MIT Lincoln Laboratory

    Authors

    • Greg Calusine

      MIT Lincoln Lab, MIT Lincoln Laboratory

    • Wayne Woods

      MIT Lincoln Lab, MIT Lincoln Laboratory

    • Alexander Melville

      MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    • Kyle Serniak

      MIT Lincoln Lab, Yale University, MIT Lincoln Laboratory, Applied Physics, Yale University

    • David K Kim

      MIT Lincoln Laboratory, MIT Lincoln Lab, MIT-Lincoln Lab, MIT Lincoln Laboratories, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    • Jonilyn Yoder

      MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology (MIT) Lincoln Laboratory

    • William Oliver

      Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog

    View abstract →

  • Effects of surface treatments and packaging on transmon qubits

    ORAL

    Presenters

    • Matthias Mergenthaler

      IBM Research - Zurich

    Authors

    • Matthias Mergenthaler

      IBM Research - Zurich

    • Clemens Mueller

      IBM Research - Zurich, ETH Zurich

    • Marc Ganzhorn

      IBM Research - Zurich

    • Stephan Paredes

      IBM Research - Zurich

    • Peter Müller

      IBM Research - Zurich

    • Stefan Filipp

      IBM Research - Zurich

    • Andreas Fuhrer

      IBM Research - Zurich

    View abstract →