Superconducting Qubits: 3D Integration and Cryogenic Packaging
ORAL · X16 · ID: 353119
Presentations
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Scalable packaging for superconducting qubits with vertical wiring
ORAL
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Presenters
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Shuhei Tamate
Research Center for Advanced Science and Technology, The University of Tokyo, The University of Tokyo
Authors
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Shuhei Tamate
Research Center for Advanced Science and Technology, The University of Tokyo, The University of Tokyo
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Yutaka Tabuchi
Research Center for Advanced Science and Technology, The University of Tokyo, The University of Tokyo
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Laszlo Szikszai
Center for Emergent Matter Science, RIKEN
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Koichi Kusuyama
Center for Emergent Matter Science, RIKEN
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Kun Zuo
Center for Emergent Matter Science, RIKEN, RIKEN, Center for Emergent Matter Science (CEMS), RIKEN
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Yuji Hishida
National Institute of Information and Communications Technology
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Wei Qiu
National Institute of Information and Communications Technology, Advanced ICT research institute, NICT, Advanced ICT Research Institute, National Institute of Information and Communications Technology
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Hirotaka Terai
National Institute of Information and Communications Technology, Advanced ICT research institute, NICT, Advanced ICT Research Institute, National Institute of Information and Communications Technology
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Masahiro Ukibe
National Institute of Advanced Industrial Science and Technology
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Go Fujii
National Institute of Advanced Industrial Science and Technology
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Kazumasa Makise
National Institute of Advanced Industrial Science and Technology
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Naoya Watanabe
National Institute of Advanced Industrial Science and Technology
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Katsuya Kikuchi
National Institute of Advanced Industrial Science and Technology
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Yasunobu Nakamura
Research Center for Advanced Science and Technology, The University of Tokyo, Univ of Tokyo, RIKEN, RCAST, The University of Tokyo, The University of Tokyo
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Multilayer Microwave Integrated Quantum Circuits: Part 1
ORAL
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Presenters
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Chan U Lei
Yale University
Authors
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Chan U Lei
Yale University
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Lev Krayzman
Yale University
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Suhas Ganjam
Yale University
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Luigi Frunzio
Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University
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Robert Schoelkopf
Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University
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Multilayer Microwave Integrated Quantum Circuits: Part 2
ORAL
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Presenters
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Lev Krayzman
Yale University
Authors
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Lev Krayzman
Yale University
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Chan U Lei
Yale University
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Suhas Ganjam
Yale University
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Luigi Frunzio
Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University
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Robert Schoelkopf
Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University
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Multilayer Microwave Integrated Quantum Circuits: Part 3
ORAL
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Presenters
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Suhas Ganjam
Yale University
Authors
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Suhas Ganjam
Yale University
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Chan U Lei
Yale University
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Lev Krayzman
Yale University
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Luigi Frunzio
Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University
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Robert Schoelkopf
Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University
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Principles of Microwave Package Design for Superconducting Quantum Processors
ORAL
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Presenters
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Sihao Huang
Department of Physics, Massachusetts Institute of Technology
Authors
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Sihao Huang
Department of Physics, Massachusetts Institute of Technology
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Benjamin Lienhard
Research Laboratory of Electronics, Massachusetts Institute of Technology, Massachusetts Institute of Technology MIT
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Bharath Kannan
Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology (MIT)
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Jochen Braumüller
Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT
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David K Kim
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT-Lincoln Lab, MIT Lincoln Laboratories, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), Massachusetts Institute of Technology (MIT) Lincoln Laboratory
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Joel Wang
Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Physics, MIT, Research Laboratory of Electronics, Massachusetts Institute of Technology (MIT)
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Alexander Melville
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology (MIT) Lincoln Laboratory
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Bethany Niedzielski
MIT Lincoln Laboratory
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Jonilyn Yoder
MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology (MIT) Lincoln Laboratory
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Terry Philip Orlando
Electrical Engineering and Computer Science, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology (MIT)
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Simon Gustavsson
Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology (MIT)
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William Oliver
Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog
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3D Integration with Protected Qubits
ORAL
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Presenters
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Anjali Premkumar
Princeton University, Department of Electrical Engineering, Princeton University
Authors
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Anjali Premkumar
Princeton University, Department of Electrical Engineering, Princeton University
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Andras Gyenis
Princeton University, Department of Electrical Engineering, Princeton University
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Pranav Mundada
Princeton University, Department of Electrical Engineering, Princeton University, Electrical Engineering, Princeton University
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Andrew Houck
Princeton University, Electrical Engineering, Princeton University, Department of Electrical Engineering, Princeton University
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Quantifying the impact of a caps and vias architecture for superconducting qubits
ORAL
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Presenters
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Keith Jackson
Rigetti Quantum Computing
Authors
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Keith Jackson
Rigetti Quantum Computing
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Andrew Bestwick
Rigetti Quantum Computing
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Shane A Caldwell
Rigetti Quantum Computing
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Matthew J Reagor
Rigetti Quantum Computing
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Design Considerations for Near-term Quantum Processors
ORAL
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Presenters
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Anna Stockklauser
Rigetti Quantum Computing
Authors
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Anna Stockklauser
Rigetti Quantum Computing
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Cryogenic Thermalization Measurements of Microwave Attenuators
ORAL
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Presenters
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Aniket Maiti
Yale University
Authors
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Aniket Maiti
Yale University
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Vijay Jain
Yale University
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Luigi Frunzio
Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University
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Robert Schoelkopf
Yale University, Department of Applied Physics, Yale University, Departments of Applied Physics and Physics, Yale University
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Dilution-equivalent solid-state chip refrigeration
ORAL
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Presenters
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Alberto Ronzani
VTT Micro & Nanoelectronics, Aalto University
Authors
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Alberto Ronzani
VTT Micro & Nanoelectronics, Aalto University
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Janne Lehtinen
VTT Micro & Nanoelectronics, VTT Technical Research Centre of Finland Ltd
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Emma Mykkanen
VTT Micro & Nanoelectronics
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Antti Kemppinen
VTT Micro & Nanoelectronics
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Leif Grönberg
VTT Micro & Nanoelectronics, VTT Technical Research Centre of Finland Ltd, QTF Center of Excellence, VTT Technical Research Centre of Finland, VTT Techical Research Center of Finland Ltd.
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Antti Manninen
VTT Micro & Nanoelectronics
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Mika Prunnila
VTT Micro & Nanoelectronics, VTT Technical Research Centre of Finland Ltd, Micro & Nanoelectronics, VTT Technical Research Centre of Finland, VTT Technical Research Centre of Finland
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Hot electron measurements below 100 mK for quantum devices
ORAL
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Presenters
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Zachary Steffen
University of Maryland, College Park
Authors
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Zachary Steffen
University of Maryland, College Park
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Sudeep Dutta
University of Maryland, College Park, University of Maryland College Park
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Rui Zhang
University of Maryland, College Park
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Yizhou Huang
University of Maryland, College Park
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Kungang Li
University of Maryland, College Park
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Frederick C Wellstood
University of Maryland, College Park, University of Maryland College Park
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Benjamin Palmer
University of Maryland, College Park, Laboratory of Physical Sciences
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Extending Superconducting Qubits Out of Plane (Part 1): Qubits with Air Bridge Crossovers in Multi-Tier Stacks
ORAL
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Presenters
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Jonilyn Yoder
MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology (MIT) Lincoln Laboratory
Authors
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Jonilyn Yoder
MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology (MIT) Lincoln Laboratory
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Justin Mallek
MIT Lincoln Laboratory
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David K Kim
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT-Lincoln Lab, MIT Lincoln Laboratories, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), Massachusetts Institute of Technology (MIT) Lincoln Laboratory
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Donna-Ruth Yost
MIT Lincoln Laboratory
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Greg Calusine
MIT Lincoln Lab, MIT Lincoln Laboratory
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Rabindra Das
MIT Lincoln Laboratory, MIT Lincoln Laboratories
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Alexandra Day
MIT Lincoln Laboratory, Massachusetts Institute of Technology MIT
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Alexander Melville
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology (MIT) Lincoln Laboratory
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Bethany M Niedzielski
MIT Lincoln Laboratory
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Danna Rosenberg
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology
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Gabriel Orr Samach
MIT Research Laboratory of Electronics, MIT Department of Electrical Engineering and Computer Science, MIT Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory
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Mollie Schwartz
MIT Lincoln Laboratory, MIT Lincoln Lab
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Steven Weber
MIT Lincoln Laboratory
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William Oliver
Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog
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Extending Superconducting Qubits Out of Plane (Part 2): Through-Silicon Vias
ORAL
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Presenters
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Justin Mallek
MIT Lincoln Laboratory
Authors
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Justin Mallek
MIT Lincoln Laboratory
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Jonilyn Yoder
MIT Lincoln Laboratory, MIT-Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), MIT Lincoln Lab
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Donna-Ruth Yost
MIT Lincoln Laboratory
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Rabindra Das
MIT Lincoln Laboratory, MIT Lincoln Laboratories
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Alexandra Day
MIT Lincoln Laboratory, Massachusetts Institute of Technology MIT
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Danna Rosenberg
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology
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Greg Calusine
MIT Lincoln Lab, MIT Lincoln Laboratory
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Matthew Cook
MIT Lincoln Laboratory
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Evan Golden
MIT Lincoln Laboratory, Massachusetts Institute of Technology MIT
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David K Kim
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT-Lincoln Lab, MIT Lincoln Laboratories, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), Massachusetts Institute of Technology (MIT) Lincoln Laboratory
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Alexander Melville
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology (MIT) Lincoln Laboratory
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Bethany Niedzielski
MIT Lincoln Laboratory
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Mollie Schwartz
MIT Lincoln Laboratory, MIT Lincoln Lab
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Corey Stull
MIT Lincoln Laboratory
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Sergey Tolpygo
MIT Lincoln Laboratory
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Wayne Woods
MIT Lincoln Lab, MIT Lincoln Laboratory
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William Oliver
Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog
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Quantifying Losses in Transmon Qubits
ORAL
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Presenters
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Greg Calusine
MIT Lincoln Lab, MIT Lincoln Laboratory
Authors
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Greg Calusine
MIT Lincoln Lab, MIT Lincoln Laboratory
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Wayne Woods
MIT Lincoln Lab, MIT Lincoln Laboratory
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Alexander Melville
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT Lincoln Laboratories, Massachusetts Institute of Technology (MIT) Lincoln Laboratory
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Kyle Serniak
MIT Lincoln Lab, Yale University, MIT Lincoln Laboratory, Applied Physics, Yale University
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David K Kim
MIT Lincoln Laboratory, MIT Lincoln Lab, MIT-Lincoln Lab, MIT Lincoln Laboratories, Lincoln Laboratory, Massachusetts Institute of Technology (MIT), Massachusetts Institute of Technology (MIT) Lincoln Laboratory
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Jonilyn Yoder
MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology (MIT) Lincoln Laboratory
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William Oliver
Research Laboratory of Electronics, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Techn, MIT Lincoln Lab, MIT Lincoln Laboratory, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology MIT, Massachusetts Institute of Technology MIT, Department of Electrical Engineering and Computer Science, Department of Physics, Massachusetts Institute of Technology; MIT Lincoln Laboratory, Department of Electrical Engineering and Computer Science, Department of Physics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Department of Electrical Engineering & Computer Science, Department of Physics, Massachusetts Institute of Technology and MIT Lincoln Labo, Physics, MIT, MIT-Lincoln Lab, MIT Lincoln Laboratories, Research Laboratory of Electronics, Department of Physics, Department of Electrical Engineering and Computer Science, Lincoln Laboratory, Massachusetts Institute of Technolog
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Effects of surface treatments and packaging on transmon qubits
ORAL
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Presenters
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Matthias Mergenthaler
IBM Research - Zurich
Authors
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Matthias Mergenthaler
IBM Research - Zurich
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Clemens Mueller
IBM Research - Zurich, ETH Zurich
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Marc Ganzhorn
IBM Research - Zurich
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Stephan Paredes
IBM Research - Zurich
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Peter Müller
IBM Research - Zurich
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Stefan Filipp
IBM Research - Zurich
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Andreas Fuhrer
IBM Research - Zurich
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