Reconfigurable Mixed-Kernel Heterojunction Transistors for Personalized Support Vector Machine Hardware

ORAL

Abstract

Mixed-dimensional van der Waals heterojunctions have enabled electrostatically tunable response functions in electronics, photonics, and optoelectronic devices. Reconfigurable responses can be further controlled by two factors. First, dual-gated p-n heterojunctions between one- and two-dimensional materials allow asymmetric screening effects.[1,2] Second, the self-aligned fabrication method is the key to well-controlled carrier modulation and resulting current pathways through constituent heterojunction and p- and n-type series transistors.[1,2] Here we report reconfigurable mixed-kernel transistors based on dual-gated 1D/2D van der Waals heterojunctions that can generate fully tunable Gaussian, sigmoid, and mixed Gaussian/sigmoid response functions (kernels).[3] The resulting heterojunction-generated kernels are employed in support vector machine (SVM) algorithms for arrhythmia detection from electrocardiogram (ECG) signals with high classification accuracy. Hardware implementation of SVM for edge applications is currently impractical due to the complexity and high power consumption needed for kernel optimization using conventional complementary metal-oxide semiconductors (CMOS) circuits. In addition, the reconfigurable mixed-kernel heterojunction transistors also allow for personalized detection using Bayesian optimization. A single mixed-kernel heterojunction device can generate the equivalent response function of a CMOS circuit comprised of several dozens of transistors, making this approach an ultralow-power hardware kernel generator with broad applicability to SVM classification. [3]

[1] Nano Letters 18, 1421 (2018)

[2] Nature Communications 11, 1565 (2020)

[3] Nature Electronics DOI:10.1038/s41928-023-01042-7 (2023)

Publication: Nature Electronics DOI:10.1038/s41928-023-01042-7 (2023)

Presenters

  • Vinod K Sangwan

    Northwestern University

Authors

  • Vinod K Sangwan

    Northwestern University

  • Xiaodong Yan

    Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois, USA

  • Justin H Qian

    Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois, USA

  • Jiahui Ma

    Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California, USA

  • Aoyang Zhang

    Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California, USA

  • Stephanie E Liu

    Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois, USA

  • Matthew P Bland

    Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois, USA

  • Kevin J Liu

    Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois, USA

  • Xuechun Wang

    Biomedical Engineering Department, University of Southern California, Los Angeles, California, USA.

  • Han Wang

    Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California, USA.

  • Mark C Hersam

    Northwestern University