Oral: Advances in Spin Qubit Devices: Interconnect and Magnet Optimization for Scalability

Recent developments in control of spin qubits have shown exciting results [1,2]. In order to successfully scale quantum chips to larger numbers of high-fidelity qubits, improvement in the quality of the material is necessary. In this talk, we present some of our recent work on metals, magnetic material, and dielectric material analysis used in the fabrication of our spin qubit devices. Such analyses are critical to get a better understanding on how to improve performance of our devices to increase scalability. First, we describe the multi-layered test structures added alongside the spin qubit devices in order to evaluate how material properties change throughout the fabrication process [3]. We find that selected fabrication steps lead to increase in the resistivity of the palladium interconnects. Then, we discuss the optimization of the magnetic films used to create the micromagnets that are used for qubit driving and addressability. Finally, with metal-insulator-metal devices, we evaluate the quality of the dielectric material and show what impact the lithographic process (e.g., optical vs. e-beam) has on its reliability.