3D Integration for Extensible Quantum Processors

ORAL · Invited

Abstract

As superconducting qubit performance continues to evolve, we must also address the interconnect challenge for superconducting quantum processors (SQPs). Multi-level wiring and heterogeneous integration developed for classical integrated circuits can be optimized for SQPs. 3D integration technologies require optimization for superconducting quantum systems since many integration technologies contain normal metals and lossy dielectrics which can compromise the performance of superconducting qubits. Integration technologies include air-bridges for crossing signals [1]; flip-chip integration with indium bump bonds and silicon hard-stop spacers to couple multiple chips [2,3]; superconducting through silicon vias to route signals through chips [4] and enable novel circuit elements [5]; multilevel planarized wiring to support complex routing schemes [6]; and multi-tier stacks which can enable complex control and readout of superconducting quantum arrays [4,7,8]. I will discuss challenges of implementing and vetting 3D heterogeneous technologies to enable extensible superconducting qubit processors.



[1] D. Rosenberg et al., IEEE microwave (2020)

[2] D. Rosenberg et al., npj QI (2017)

[3] B. M. Niedzielski et al., IEEE IEDM (2019)

[4] Yost*, Schwartz*, Mallek*, et al., npj QI (2020)

[5] T. Hazard, et.al. APL (2023)

[6] Tolpygo et al., IEEE Appl. Supercond. (2016)

[7] Karamlou et al., arXiv:2306.02571v3 (2023)

[8] C. Barrett et al., Phys. Rev. Appl. (2023)

* This work is supported by a collaboration between the U.S. Department of Energy, Office of Science, National Quantum Information Science Research Centers, Quantum Systems Accelerator; the Defense Advanced Research Projects Agency; and the Under Secretary of Defense for Research and Engineering under Air Force Contract No. FA8702-15-D-0001. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the Department of Energy, the Under Secretary of Defense for Research and Engineering, or the Defense Advanced Research Projects Agency.

–

Publication: [1] D. Rosenberg et al., IEEE microwave (2020)
[2] D. Rosenberg et al., npj QI (2017)
[3] B. M. Niedzielski et al., IEEE IEDM (2019)
[4] Yost*, Schwartz*, Mallek*, et al., npj QI (2020)
[5] Hazard, et.al. APL (2023)

Presenters

  • Donna-Ruth W Yost

    MIT - Lincoln Laboratory

Authors

  • Donna-Ruth W Yost

    MIT - Lincoln Laboratory