Fabrication and Characterization of Waterborne Multi-wall Carbon Nanotube Paints

POSTER

Abstract

The fabrication of water-borne polyurethane nanocomposites containing multi-wall nanotubes has presented a significant technological challenge to those in the polymer community. Such conductive polyurethanes are of great interest to the paint and coatings industry for use in electrical grounding and shielding. Currently, these materials are formed by strong acidic reflux of the nanotubes and subsequent dispersal in the polymer matrix. This treatment can result in significant shortening of the tubes and degradation of the resulting mechanical and electrical transport properties. Here we present an alternate technique in which various conductive and non-conductive water-soluble polymers are physi-adsorbed to the surface of the nanotube. These interactions with the nanotubes result in highly uniform suspensions of water-based urethane coatings and bulk materials. We will examine the polymer chemistry and morphologies of these nanostructured materials and the resulting thermal, electrical and mechanical properties.

Authors

  • Perry Yaney

    Department of Physics, University of Oregon, USAF Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio, NHMFL, CRIEPI, UCSD, University of Dayton, L-3 Communications Cincinnati Electronics, University of Georgia, Air Force Research Laboratory, Anteon Corporation, California State University-Chico, The Ohio State University, Univ. Akron, Air Force Institute of Technology, Albion College, Albion, MI 49224, Physics Department, University of Florida, Gainesville, Mound Laser \& Photonics Center, Inc., Hitachi Global Storage Technologies, San Jose, CA 95120, University of Dayton Research Institute, University of South Alabama, Jet Propulsion Laboratory, Anteon, Universidad Michoacana de San Nicolas de Hidalgo, Morelia, Michoac\'{a}n, Mexico, Department of Chemistry, The University of Akron, Department of Physics, The University of Akron, Physics Department and The Future-Chips Constellation, Renssalaer Polytechnic Institute, Local Co-Chair

  • Perry Yaney

    Department of Physics, University of Oregon, USAF Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio, NHMFL, CRIEPI, UCSD, University of Dayton, L-3 Communications Cincinnati Electronics, University of Georgia, Air Force Research Laboratory, Anteon Corporation, California State University-Chico, The Ohio State University, Univ. Akron, Air Force Institute of Technology, Albion College, Albion, MI 49224, Physics Department, University of Florida, Gainesville, Mound Laser \& Photonics Center, Inc., Hitachi Global Storage Technologies, San Jose, CA 95120, University of Dayton Research Institute, University of South Alabama, Jet Propulsion Laboratory, Anteon, Universidad Michoacana de San Nicolas de Hidalgo, Morelia, Michoac\'{a}n, Mexico, Department of Chemistry, The University of Akron, Department of Physics, The University of Akron, Physics Department and The Future-Chips Constellation, Renssalaer Polytechnic Institute, Local Co-Chair

  • Perry Yaney

    Department of Physics, University of Oregon, USAF Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio, NHMFL, CRIEPI, UCSD, University of Dayton, L-3 Communications Cincinnati Electronics, University of Georgia, Air Force Research Laboratory, Anteon Corporation, California State University-Chico, The Ohio State University, Univ. Akron, Air Force Institute of Technology, Albion College, Albion, MI 49224, Physics Department, University of Florida, Gainesville, Mound Laser \& Photonics Center, Inc., Hitachi Global Storage Technologies, San Jose, CA 95120, University of Dayton Research Institute, University of South Alabama, Jet Propulsion Laboratory, Anteon, Universidad Michoacana de San Nicolas de Hidalgo, Morelia, Michoac\'{a}n, Mexico, Department of Chemistry, The University of Akron, Department of Physics, The University of Akron, Physics Department and The Future-Chips Constellation, Renssalaer Polytechnic Institute, Local Co-Chair

  • Perry Yaney

    Department of Physics, University of Oregon, USAF Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio, NHMFL, CRIEPI, UCSD, University of Dayton, L-3 Communications Cincinnati Electronics, University of Georgia, Air Force Research Laboratory, Anteon Corporation, California State University-Chico, The Ohio State University, Univ. Akron, Air Force Institute of Technology, Albion College, Albion, MI 49224, Physics Department, University of Florida, Gainesville, Mound Laser \& Photonics Center, Inc., Hitachi Global Storage Technologies, San Jose, CA 95120, University of Dayton Research Institute, University of South Alabama, Jet Propulsion Laboratory, Anteon, Universidad Michoacana de San Nicolas de Hidalgo, Morelia, Michoac\'{a}n, Mexico, Department of Chemistry, The University of Akron, Department of Physics, The University of Akron, Physics Department and The Future-Chips Constellation, Renssalaer Polytechnic Institute, Local Co-Chair

  • Perry Yaney

    Department of Physics, University of Oregon, USAF Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio, NHMFL, CRIEPI, UCSD, University of Dayton, L-3 Communications Cincinnati Electronics, University of Georgia, Air Force Research Laboratory, Anteon Corporation, California State University-Chico, The Ohio State University, Univ. Akron, Air Force Institute of Technology, Albion College, Albion, MI 49224, Physics Department, University of Florida, Gainesville, Mound Laser \& Photonics Center, Inc., Hitachi Global Storage Technologies, San Jose, CA 95120, University of Dayton Research Institute, University of South Alabama, Jet Propulsion Laboratory, Anteon, Universidad Michoacana de San Nicolas de Hidalgo, Morelia, Michoac\'{a}n, Mexico, Department of Chemistry, The University of Akron, Department of Physics, The University of Akron, Physics Department and The Future-Chips Constellation, Renssalaer Polytechnic Institute, Local Co-Chair

  • Perry Yaney

    Department of Physics, University of Oregon, USAF Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio, NHMFL, CRIEPI, UCSD, University of Dayton, L-3 Communications Cincinnati Electronics, University of Georgia, Air Force Research Laboratory, Anteon Corporation, California State University-Chico, The Ohio State University, Univ. Akron, Air Force Institute of Technology, Albion College, Albion, MI 49224, Physics Department, University of Florida, Gainesville, Mound Laser \& Photonics Center, Inc., Hitachi Global Storage Technologies, San Jose, CA 95120, University of Dayton Research Institute, University of South Alabama, Jet Propulsion Laboratory, Anteon, Universidad Michoacana de San Nicolas de Hidalgo, Morelia, Michoac\'{a}n, Mexico, Department of Chemistry, The University of Akron, Department of Physics, The University of Akron, Physics Department and The Future-Chips Constellation, Renssalaer Polytechnic Institute, Local Co-Chair

  • Perry Yaney

    Department of Physics, University of Oregon, USAF Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio, NHMFL, CRIEPI, UCSD, University of Dayton, L-3 Communications Cincinnati Electronics, University of Georgia, Air Force Research Laboratory, Anteon Corporation, California State University-Chico, The Ohio State University, Univ. Akron, Air Force Institute of Technology, Albion College, Albion, MI 49224, Physics Department, University of Florida, Gainesville, Mound Laser \& Photonics Center, Inc., Hitachi Global Storage Technologies, San Jose, CA 95120, University of Dayton Research Institute, University of South Alabama, Jet Propulsion Laboratory, Anteon, Universidad Michoacana de San Nicolas de Hidalgo, Morelia, Michoac\'{a}n, Mexico, Department of Chemistry, The University of Akron, Department of Physics, The University of Akron, Physics Department and The Future-Chips Constellation, Renssalaer Polytechnic Institute, Local Co-Chair