Investigation of Electrospun Nanocomposite Polymer Nanofibers

POSTER

Abstract

Electrospinning of polymers offers the ability to reproducibly manufacture sub-micron diameter fibers with desired morphologies. Conductive electrospun fibers offer new avenues to producing high surface area electrodes and membranes for a variety of applications. The goal of this work was to produce controlled nanostructured morphologies by the electrospinning of intrinsically conductive polymers, nanocomposites containing carbon nanotubes, and Nylon 6/layered silicate nanocomposites (NLS). Additionally, intentionally phase separated polymer nanofiber structures of intrinsically conductive polymer / polyurethane blends were also produced. The extremely high interfacial area of these fiber materials is of great interest for reinforced composites, chemical/biological filtration, protective clothing, and biomedical applications such as wound dressing. Of particular significance is for use in high surface area electrodes for hybrid organic-inorganic photovoltaic devices.

Authors

  • Max Alexander

    Air Force Research Lab, AFRL/MLBP

  • Brandon Black

    Air Force Research Lab

  • Perry Yaney

    Department of Physics, University of Oregon, USAF Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio, NHMFL, CRIEPI, UCSD, University of Dayton, L-3 Communications Cincinnati Electronics, University of Georgia, Air Force Research Laboratory, Anteon Corporation, California State University-Chico, The Ohio State University, Univ. Akron, Air Force Institute of Technology, Albion College, Albion, MI 49224, Physics Department, University of Florida, Gainesville, Mound Laser \& Photonics Center, Inc., Hitachi Global Storage Technologies, San Jose, CA 95120, University of Dayton Research Institute, University of South Alabama, Jet Propulsion Laboratory, Anteon, Universidad Michoacana de San Nicolas de Hidalgo, Morelia, Michoac\'{a}n, Mexico, Department of Chemistry, The University of Akron, Department of Physics, The University of Akron, Physics Department and The Future-Chips Constellation, Renssalaer Polytechnic Institute, Local Co-Chair

  • Perry Yaney

    Department of Physics, University of Oregon, USAF Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio, NHMFL, CRIEPI, UCSD, University of Dayton, L-3 Communications Cincinnati Electronics, University of Georgia, Air Force Research Laboratory, Anteon Corporation, California State University-Chico, The Ohio State University, Univ. Akron, Air Force Institute of Technology, Albion College, Albion, MI 49224, Physics Department, University of Florida, Gainesville, Mound Laser \& Photonics Center, Inc., Hitachi Global Storage Technologies, San Jose, CA 95120, University of Dayton Research Institute, University of South Alabama, Jet Propulsion Laboratory, Anteon, Universidad Michoacana de San Nicolas de Hidalgo, Morelia, Michoac\'{a}n, Mexico, Department of Chemistry, The University of Akron, Department of Physics, The University of Akron, Physics Department and The Future-Chips Constellation, Renssalaer Polytechnic Institute, Local Co-Chair

  • Perry Yaney

    Department of Physics, University of Oregon, USAF Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio, NHMFL, CRIEPI, UCSD, University of Dayton, L-3 Communications Cincinnati Electronics, University of Georgia, Air Force Research Laboratory, Anteon Corporation, California State University-Chico, The Ohio State University, Univ. Akron, Air Force Institute of Technology, Albion College, Albion, MI 49224, Physics Department, University of Florida, Gainesville, Mound Laser \& Photonics Center, Inc., Hitachi Global Storage Technologies, San Jose, CA 95120, University of Dayton Research Institute, University of South Alabama, Jet Propulsion Laboratory, Anteon, Universidad Michoacana de San Nicolas de Hidalgo, Morelia, Michoac\'{a}n, Mexico, Department of Chemistry, The University of Akron, Department of Physics, The University of Akron, Physics Department and The Future-Chips Constellation, Renssalaer Polytechnic Institute, Local Co-Chair

  • Perry Yaney

    Department of Physics, University of Oregon, USAF Research Laboratory, Materials and Manufacturing Directorate, Wright-Patterson AFB, Ohio, NHMFL, CRIEPI, UCSD, University of Dayton, L-3 Communications Cincinnati Electronics, University of Georgia, Air Force Research Laboratory, Anteon Corporation, California State University-Chico, The Ohio State University, Univ. Akron, Air Force Institute of Technology, Albion College, Albion, MI 49224, Physics Department, University of Florida, Gainesville, Mound Laser \& Photonics Center, Inc., Hitachi Global Storage Technologies, San Jose, CA 95120, University of Dayton Research Institute, University of South Alabama, Jet Propulsion Laboratory, Anteon, Universidad Michoacana de San Nicolas de Hidalgo, Morelia, Michoac\'{a}n, Mexico, Department of Chemistry, The University of Akron, Department of Physics, The University of Akron, Physics Department and The Future-Chips Constellation, Renssalaer Polytechnic Institute, Local Co-Chair