planarization techniques for integrated waveguide detectors

ORAL

Abstract

Wafer curvature is a common complication during device processing. A minimal wafer curvature is critical when fabricating 3-dimensional integrated circuits. Chemical mechanical planarization (CMP) is a relatively new process used to planarize topographical surfaces. However, when removing small-scale topographical features CMP is limited by the amount of material to be removed and wafer curvature. We have developed a wet thermal oxidation planarization process to bypass the need for the CMP process. This oxidation process has been implemented in the development of a Si$_{3}$N$_{4}$ on Si, waveguide on photodetector device.

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Authors

  • Michael Buzbee

    Electro-Optics Graduate Program, University of Dayton, Dayton, Ohio 45469

  • Brian Knauf

    Electro-Optics Graduate Program, University of Dayton, Dayton, Ohio 45469, Bowling Green State University, Washington State University, Nuclear Radiation Center, Washington State University, Electro-Optics Program, University of Dayton, Dayton, OH 45469, Department of Chemistry and Biochemistry, Arizona State University, Tempe, AZ, Department of Physics, Arizona State University, Tempe, AZ, Nano-C, Inc., U. S. Army Research Laboratory, Professor, TA, None

  • Brian Knauf

    Electro-Optics Graduate Program, University of Dayton, Dayton, Ohio 45469, Bowling Green State University, Washington State University, Nuclear Radiation Center, Washington State University, Electro-Optics Program, University of Dayton, Dayton, OH 45469, Department of Chemistry and Biochemistry, Arizona State University, Tempe, AZ, Department of Physics, Arizona State University, Tempe, AZ, Nano-C, Inc., U. S. Army Research Laboratory, Professor, TA, None

  • Brian Knauf

    Electro-Optics Graduate Program, University of Dayton, Dayton, Ohio 45469, Bowling Green State University, Washington State University, Nuclear Radiation Center, Washington State University, Electro-Optics Program, University of Dayton, Dayton, OH 45469, Department of Chemistry and Biochemistry, Arizona State University, Tempe, AZ, Department of Physics, Arizona State University, Tempe, AZ, Nano-C, Inc., U. S. Army Research Laboratory, Professor, TA, None

  • Imad Agha

    Department of Physics and Electro-Optics Graduate Program, University of Dayton, Dayton, Ohio 45469, University of Dayton, OH, Department of Physics and Electro-Optics Graduate Program University of Dayton, Dayton, Ohio 45469, University of Dayton