Kinetics of Tin Whisker Growth

Tin whiskers are single-crystalline structures that grow out of tin-rich surfaces. Whiskers are found to grow most notably on thin surfaces, such as those deposited via electroplating or sputtering [2]. Tin whiskers are highly conductive and pose a threat to many systems via their ability to cause short circuits, bringing about malfunctions in products from satellites to pacemakers [3]. Little is known about the growth mechanisms of whiskers, but many agree that stress is a necessary factor. This research aims to evaluate the necessary components of tin whisker growth. We hypothesize that stress and nucleation points are the critical features for whiskers to form. Uniting nucleation points and stress through etching and bending respectively, we hope to find an increased whisker growth, showing that these components are necessary for whisker growth. Through the understanding of why whiskers grow, we hope to control the location, orientation, and occasion of whisker growth. These abilities will enable us to stop harmful whisker growth and use whiskers for beneficial use, such as in the MEMS field.