Crystallographic Damage Formation at the Breakout Surface in Copper during Shock Loading

We are using Transient Imaging Displacement Interferometry (TIDI) to unravel the dynamics of damage formation in copper. The images obtained from TIDI reveal a rich and complex dynamics during shock and release at the specimen's breakout surface in flyer plate-launched shock experiments. Included in the observations are elastic movement of grain boundaries and onset of damage at grain boundary junctions that remains in the material post-shot. In single crystal targets, we have also observed localized regions of damage having crystallographic symmetry that appear in the leading compression edge of the shock-up, persist through the release and remain in the material post-shot. This talk will focus on our single-crystal results and observations concerning the unexpected early-time phenomenon.