High-Resolution Microcircuit Fabrication on Diamond Anvils for Extreme Conditions

We present a novel fabrication process for producing high-quality metallic structures on diamond anvils, achieving feature sizes as small as 500 nm using a bi-layer resist and electron beam lithography. Optimized surface treatments ensure strong adhesion of metallic lift-off structures. Deposition of materials such as W, Ta, Nb, Al, Au, Cr, Ti, and SiO₂ is demonstrated via electron beam deposition and magnetron sputtering. Thin film transfer techniques are employed to enable precise placement of thin (<100 nm) exfoliated samples on circuit platforms. This work establishes a robust and versatile approach for fabricating microcircuits on diamond, enabling reliable performance under extreme conditions of high pressures and cryogenic temperatures.