Millikelvin CMOS-technology for quantum electronics
ORAL
Abstract
Scaling up silicon-based quantum processors will require high-performance cryo-CMOS electronics operating at deep cryogenic temperatures. In order to match the power consumption of silicon CMOS integrated circuits to the thermal budget provided by millikelvin refrigeration techniques, Si-MOSFET switching metrics have to be improved beyond current low-temperature limits, set by band-tail states. Based on recent progress in understanding low-temperature band-edge physics in silicon, we introduce fully depleted silicon-on-insulator MOSFETs, manufactured on a cryo-CMOS and SiMOS-qubit pilot line, which are tailored for ultra-low power applications in quantum electronics. With these transistors we consistently achieve record-low subthreshold swing in the range of 0.3 - 2 mV/dec at 0.4 K, enabling a reduction in supply voltage and consequent power dissipation of cryo-CMOS ICs to millikelvin-compatible levels. In combination with back-end processing and packaging techniques designed for cryogenic applications, this can enable very-large-scale integrated quantum ICs for fault-tolerant quantum computing.
*This research was funded by the European Union's Horizon EIC programme under grant agreement No. 101136793 (SCALLOP) and Chips Joint Undertaking programme under grant agreement No. 101139908 (ARCTIC), Business Finland project 10200/31/2022 (ToScaleQC) and EU EURAMET project AQuanTEC (23FUN05).
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Publication: Millikelvin Si-MOSFETs for Quantum Electronics, arXiv:2410.01077
Presenters
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Nikolai Yurttagül
- SemiQon