A TWPA with Integrated Bias Circuitry and Impedance-Engineered Phase Matching
ORAL
Abstract
The Traveling-Wave Parametric Amplifier (TWPA) has revolutionized quantum information research by providing broadband amplification with noise performance approaching the quantum limit. A drawback of modern TWPAs is that they are typically packaged without bias circuitry, requiring the use of external components such as directional couplers. In this work we move toward better system-level integration of a 4-12 GHz, four-wave mixing TWPA by including input and output networks on-chip. Furthermore, typical resonant phase matching (RPM) techniques introduce an impedance mismatch near the pump frequency. Here, we investigate a possible solution to this issue.
–
Presenters
-
Connor Denney
- Colorado School of Mines
- National Institute of Standards and Technology, Colorado School of Mines
- NIST