High-Throughput Microwave Package for Precise Superconducting Device Measurement
ORAL
Abstract
Cryogenic microwave measurements of superconducting devices are often limited by the complexity of their packaging. We present a wire-bond-free, PCB-free, drop-in microwave package for on-chip superconducting devices. The package uses a superconducting aluminum cavity with a suspended tungsten pin for signal transmission. The cavity mode is well detuned from the 4-8 GHz range, and the transmission ripple is below 3 dB. Using this design, we measure the dielectric loss tangent of superconducting ring resonators as (1.15±0.04)×10-6. This high-throughput platform enables fast, repeatable measurements across many devices and supports studies of oxide regrowth, and material improvements for superconducting devices.
*This work was supported by the Materials Characterization and Quantum Performance: Correlation and Causation (MQC) program of the Laboratory for Physical Sciences, and by funding from the University of Colorado Boulder College of Engineering and Applied Science and the Engineering Excellence Fund. Additional support was provided by the National Institute of Standards and Technology (NIST).
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Presenters
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Wei-Ren Syong
- University of Colorado, Boulder