Scalable Millikelvin Control of Packaged Quantum Integrated Circuits

The frontiers towards scalable quantum integrated circuits are marked by the challenge of understanding and engineering the more complex properties of solid-state nanoelectronic devices at ultralow temperatures [1]. In order to provide input and output capacity to Quantum processor units (QPUs) with thousands, or even millions of solid-state Qubits, we developed cryogenic Silicon CMOS integrated circuits, such as DC/microwave (de)multiplexers, amplifiers, and other application specific circuits, which are integrated with QPUs using heterogenous chiplet integration. By using novel concepts, which only arise at cryogenic temperatures, we reduce the overhead in I/O complexity and power consumption towards operating a full package of QPU chip with peripheral electronics at millikelvin temperatures. We further demonstrate how this technology can be used to scale spin, and other solid-state qubit platforms.