A Vertically Integrated Platform for Superconducting Qubit Development

Superconducting (SC) qubits is one of the most mature platforms for quantum computing, offering scalability by leveraging semiconductor technologies. However, system-level integration requires a significant effort from materials to fabrication and from characterization to applications. To address this, we have established a vertically integrated SC qubit program at Academia Sinica, providing a seamless workflow linking design, simulation, device fabrication, and qubit characterization.

This integrated approach enables rapid iteration and metric-based optimization of fabrication recipes, shortening testing cycles, and breaking down for sub-cycle development to accelerate the development. Based on systematic engineering, we have scaled our process from 5-qubit devices on 4-inch wafers to a more advanced 8-inch wafer platform for quantum chip fabrication science. Fast, automated characterization, leveraged through industrial partnerships and our QC-Test and QC-fab platforms, ensures faster convergence toward reliable device performance. Current efforts focus on scaling multi-qubit devices and performing root-cause analyses of fabrication challenges, including the validation of non-conventional junction processes. These results demonstrate how targeted programmatic coordination can de-risk and accelerate early-stage quantum hardware development, providing a platform for superconducting qubit development.