Resist-Free Stencil Deposition for Low-Loss Superconducting Circuits and Qubits (Part 1)
Oral-In-person
Abstract
Conventional liftoff techniques using organic resists are widely employed for Josephson-junction fabrication, but they can degrade metal quality and leave behind residues that are believed to limit qubit coherence. To investigate the impact of resist-based fabrication on superconducting circuits, we developed a resist-free process using a silicon nitride stencil mask, enabling wafer-scale junction deposition without organic resists.
In the first part of this two-part talk, we present our fabrication method of the silicon nitride stencil mask and its integration into wafer-scale deposition. We describe the design of the resonators used for comparing the loss between stencil-deposited and liftoff metals, and we present corresponding material characterization and measurement results.
In the first part of this two-part talk, we present our fabrication method of the silicon nitride stencil mask and its integration into wafer-scale deposition. We describe the design of the resonators used for comparing the loss between stencil-deposited and liftoff metals, and we present corresponding material characterization and measurement results.
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Presenters
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Hung-Yu Tsao
- Massachusetts Institute of Technology