Optimizing Adhesion: Evaluating B-Stage Epoxy for Bonding
POSTER
Abstract
The application of increased pressure during the curing process of B-stage epoxy
has been hypothesized to enhance the adhesive properties and bond strength in
printed wiring board (PWB) assembly. This study aimed to investigate the
correlation between pressure application and the performance of B-stage epoxy.
has been hypothesized to enhance the adhesive properties and bond strength in
printed wiring board (PWB) assembly. This study aimed to investigate the
correlation between pressure application and the performance of B-stage epoxy.
Publication: Roller, M.B. (1975), Characterization of the time-temperature-viscosity behavior of curing
B-staged epoxy resin. Polym Eng Sci, 15: 406-414. https://doi.org/10.1002/pen.760150603
Presenters
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Joseph Perez
- St. Mary's University