One dimensional micro-patterning on flexible substrate by low frequency atmospheric pressure micro jet plasma

Micro-patterning is an attractive technology for satisfying current electronic market needs, especially for fabricating the smaller and slimmer devices. Upon considering that the traditional etching process is performed at the complex high vacuum system, high speed micro patterning based on the micro plasma generated in the ambient air is an innovative and economically beneficial method for electronics industry. In this study, the plasma source of 500 $\mu $m hole was developed to perform the feasibility study of micro-patterning. The analyses using the measured discharge current and voltage characteristic curves, optical emission spectroscopy, and intensified charge coupled device image were performed to characterize the plasma. One-dimensional micro-patterning was carried out on the super water repellent treated substrate (polyimide film or PI) surface using the micro plasma jet mounted on a XYZ stage. After the plasma treatment, the silver ink was applied to the hydrophilic line on PI film formed by the plasma. The line width was measured to be as small as 200 $\mu $m. It varied from 200 $\mu $m to 4000 $\mu $m by the applied voltage and gas flow rate. Further reduction of the line width is on-going.