3D Integration for Superconducting Qubits: Part 1

ORAL

Abstract

As the field of superconducting quantum computing advances from the few-qubit scale, it will become increasingly important to develop techniques for addressing large number of qubits without degrading their performance. 3D integration can alleviate interconnect crowding and enable the construction of large-scale arrays of coupled coherent superconducting qubits. I will present our recent work on developing and characterizing 3D integration components for quantum annealing, including indium bumps and superconducting through-silicon vias, and discuss progress towards building 3D integrated coupled qubits.

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Presenters

  • Danna Rosenberg

    MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

Authors

  • Danna Rosenberg

    MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Gregory Calusine

    MIT Lincoln Laboratory

  • Rabindra Das

    MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

  • Alexandra Day

    MIT Lincoln Laboratory

  • Evan Golden

    MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

  • Amy Greene

    Massachusetts Inst of Tech-MIT, Department of Electrical Engineering and Computer Science, Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT

  • Simon Gustavsson

    Massachusetts Institute of Technology, Research Laborotary of Electronics, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Research Laboratory of Electronics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT, MIT, Research Laboratory of Electronics, Massachusetts institute of Technology

  • Philip Krantz

    Microtechnology and nanoscience, Chalmers University of Technology, Research Laborotary of Electronics, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Research Laboratory of Electronics, Massachusetts Inst of Tech-MIT, Research Laboratory of Electronics, Massachusetts Institute of Technology

  • David Kim

    MIT Lincoln Laboratory, MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Morten Kjaergaard

    Massachusetts Inst of Tech-MIT, MIT

  • Justin Mallek

    MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

  • Alexander Melville

    MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

  • Bethany Niedzielski

    MIT Lincoln Laboratory

  • Mollie Schwartz

    MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Inst of Tech-MIT

  • Steven Weber

    MIT Lincoln Laboratory

  • Wayne Woods

    MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Inst of Tech-MIT

  • Jonilyn Yoder

    Massachusetts Institute of Technology, MIT Lincoln Laboratory

  • Donna-Ruth Yost

    MIT Lincoln Lab, Massachusetts Inst of Tech-MIT, MIT Lincoln Laboratory

  • Andrew Kerman

    MIT Lincoln Laboratory, Massachusetts Inst of Tech-MIT, MIT Lincoln Lab

  • William Oliver

    MIT Lincoln Laboratory, MIT Lincoln Lab, Massachusetts Institute of Technology & MIT Lincoln Laboratory, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Inst of Tech-MIT, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Inst of Tech-MIT, MIT, Lincoln Laboratory, Research Laboratory of Electronics, and Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts institute of Technology