Intel Superconducting Qubits, Part 2: Integration on through-silicon-via (TSV) substrates.

ORAL

Abstract

Quantum computing holds the potential for significantly improving computing speed relative to classical computing for selected algorithms and applications. Many researchers using transmons in a circuit QED quantum hardware architecture are producing chips with ever-increasing numbers of qubits. The corresponding increase in chip size shifts the cavity/drum resonant modes into a frequency range where qubits could be adversely affected. One solution is to implement through-silicon-vias (TSVs) and chip/cavity contact pins to supply more ground connections. We present recent microwave modeling and fabrication results on qubit chips containing membrane-covered TSVs. These flip chips are assembled using a ball-grid-array die-package interface for signal I/O.

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Presenters

  • David Michalak

    Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA

Authors

  • David Michalak

    Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA

  • Roman Caudillo

    Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA

  • Lester Lampert

    Components Research, Intel, Components Research, Intel Corporation, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA

  • Adel A Elsherbini

    Components Research, Intel, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA

  • Javier A Falcon

    DATD, Intel

  • Ye Seul Ashley Nam

    DATD, Intel

  • Preston T Myers

    DATD, Intel

  • Jeanette Marie Roberts

    Components Research, Intel, Components Research, Intel Corporation

  • Alessandro Bruno

    QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands

  • Nandini Muthusubramanian

    QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands, QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology

  • Cornelis Christiaan Bultink

    QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands

  • Filip Malinowski

    Delft University of Technology, University of Copenhagen, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Center for Quantum Devices, Niels Bohr Institute, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands

  • Nadia Haider

    QuTech and TNO, QuTech and Netherlands Organisation for Scientific Research (TNO), Delft, The Netherlands

  • Leonardo DiCarlo

    QuTech and Kavli Institute of Nanoscience, Delft University of Technology, QuTech and Kavli Institute of Nanoscience, Delft University of Technology, Delft, The Netherlands, QuTech and Kavli Institute of Nanoscience Delft, Delft University of Technology

  • Jim Clarke

    Components Research, Intel, Components Research, Intel Corporation, Intel, Intel Corporation, Components Research, Intel Corporation, 2501 NW 229th Avenue, Hillsboro, OR, 97124, USA