3D Integration of Superconducting Qubits in a Three-Tiered Quantum Processor

ORAL

Abstract

Heterogeneous 3D integration is an enabling technology for the construction of a quantum processor with a large number of superconducting qubits and a high degree of qubit interconnectivity. Our approach entails the construction of a three-tiered quantum processor where the high-coherence superconducting qubits are controlled and read-out through superconducting through silicon vias (TSVs) in an interposer which is bump bonded to a superconducting multichip module using indium microbumps. We will discuss our work on the fabrication and integration of the interposer with superconducting TSVs as well as the superconducting multichip module and the electrical data measured from test structures.

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Presenters

  • Justin Mallek

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

Authors

  • Justin Mallek

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Donna-Ruth Yost

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Rabindra Das

    MIT Lincoln Laboratory

  • Danna Rosenberg

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Vladimir Bolkhovsky

    MIT Lincoln Laboratory

  • Greg Calusine

    MIT Lincoln Lab, MIT Lincoln Laboratory

  • Matthew Cook

    MIT Lincoln Laboratory

  • Evan Golden

    MIT Lincoln Lab, MIT Lincoln Laboratory

  • David K Kim

    MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Alexander Melville

    MIT Lincoln Lab, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Bethany M Niedzielski

    Michigan State University, MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Mollie E. Schwartz

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Corey Stull

    MIT Lincoln Laboratory

  • Sergey Tolpygo

    MIT Lincoln Laboratory

  • Wayne Woods

    MIT Lincoln Lab, MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Jonilyn L Yoder

    MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • William D Oliver

    Research Laboratory of Electronics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Physics, Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Physics, Massachusetts Institute of Technology, Dept. of Physics, Research Laboratory of Electronics, and Lincoln Lab, Massachusetts Institute of Technology, USA, Research Laboratory of Electronics, Department of Physics, Massachusetts Institute of Technology, Cambridge, MA 02139, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, Massachusetts Institute of Technology and MIT Lincoln Laboratory, Research Laboratory of Electronics, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, MIT; Research Laboratory of Electronics, MIT; MIT Lincoln Laboratory