Superconducting qubits integrated with superconducting through-substrate vias: Measurement

ORAL

Abstract

Three-dimensional integration (3DI) is an enabling technology for superconducting qubits as circuits become larger, more complex, and more highly-connected. One promising approach to 3DI is the vertical routing of signals through superconducting through-substrate vias (TSVs), which may be integrated directly into a superconducting qubit chip or may carry signals to and from a high-coherence qubit layer via an interposer chip. We discuss recent results demonstrating superconducting qubit control, readout, and integration with high-aspect ratio superconducting TSVs.

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Presenters

  • Mollie E. Schwartz

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

Authors

  • Mollie E. Schwartz

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Donna-Ruth Yost

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Danna Rosenberg

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Justin Mallek

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Rabindra Das

    MIT Lincoln Laboratory

  • Alexandra L Day

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • David K Kim

    MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Alexander Melville

    MIT Lincoln Lab, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Bethany M Niedzielski

    Michigan State University, MIT Lincoln Laboratory, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Jonilyn L Yoder

    MIT Lincoln Lab, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Massachusetts Institute of Technology Lincoln Laboratory, Lincoln Lab, Massachusetts Institute of Technology, USA, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA 02421, MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • Andrew James Kerman

    MIT Lincoln Laboratory, Massachusetts Institute of Technology

  • William D Oliver

    Research Laboratory of Electronics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, Lincoln Laboratory, Massachusetts Institute of Technology, MIT Lincoln Lab, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Research Laboratory of Electronics, Physics, Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, Massachusetts Institute of Technology, Research Laboratory of Electronics, Massachusetts Institute of Technology, MIT Lincoln Laboratory, Physics, Massachusetts Institute of Technology, Dept. of Physics, Research Laboratory of Electronics, and Lincoln Lab, Massachusetts Institute of Technology, USA, Research Laboratory of Electronics, Department of Physics, Massachusetts Institute of Technology, Cambridge, MA 02139, MIT Lincoln Laboratory, 244 Wood Street, Lexington, MA, Massachusetts Institute of Technology and MIT Lincoln Laboratory, Research Laboratory of Electronics, MIT Lincoln Laboratory, Department of Physics, Massachusetts Institute of Technology, Department of Physics, Research Laboratory of Electronics, MIT Lincoln Laboratory, Massachusetts Institute of Technology, Department of Physics, MIT; Research Laboratory of Electronics, MIT; MIT Lincoln Laboratory