Multilayer Microwave Integrated Quantum Circuits: Part 2

High-quality superconducting bonds are a critical element in constructing multilayer microwave integrated quantum circuits (MMIQCs). In order to provide lithographic precision for 3D enclosures made in wafers, it is necessary to create cavities with a high aspect ratio which places the seam in a region of high current density. In this talk, we describe a model for quantifying the loss associated with the seam, present our progress on indium bonding in microwave circuits, and discuss its application in scalable 3D superconducting quantum circuits.