Efficient Routing and Interconnects for Superconducting Qubits

ORAL  · Invited

Abstract

As superconducting qubit performance continues to improve in single- and few- qubit demonstrations, we must also address the challenge of interconnects for superconducting quantum processors in order to reap the benefits of these advances. The interconnect challenge arises from the stringent engineering requirements necessary to route signals from room-temperature control hardware through five orders of magnitude in temperature change, into cryogenic packaging, and onto the quantum processor itself. This routing must preserve signal fidelity, maintain thermal isolation, reduce signals crosstalk, and must be done in a way that enables maintaining the highest performance in the quantum systems themselves. This talk will review our recent work in addressing these challenges at the levels of quantum hardware, packaging input/output, and cabling.

*This material is based upon work supported by the U.S. Department of Energy, Office of Science, National Quantum Information Science Research Centers, Quantum Systems Accelerator (QSA). Additional support is acknowledged from the Under Secretary of Defense for Research and Engineering under Air Force Contract No. FA8702-15-D-0001. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the Dept of Energy and Under Secretary of Defense for Research and Engineering.

Publication: R. N. Das et al., "Reworkable Superconducting Qubit Package for Quantum Computing," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 427-432.
Yost, D.R.W., Schwartz, M.E., Mallek, J. et al. Solid-state qubits integrated with superconducting through-silicon vias. npj Quantum Inf 6, 59 (2020).
D. Rosenberg et al., "Solid-State Qubits: 3D Integration and Packaging," in IEEE Microwave Magazine, vol. 21, no. 8, pp. 72-85, Aug. 2020.

Presenters

  • Mollie E Schwartz

    • MIT Lincoln Laboratory
    • Lincoln Laboratory, Massachusetts Institute of Technology

Authors

  • Mollie E Schwartz

    • MIT Lincoln Laboratory
    • Lincoln Laboratory, Massachusetts Institute of Technology