Efficient Routing and Interconnects for Superconducting Qubits
ORAL · Invited
Abstract
*This material is based upon work supported by the U.S. Department of Energy, Office of Science, National Quantum Information Science Research Centers, Quantum Systems Accelerator (QSA). Additional support is acknowledged from the Under Secretary of Defense for Research and Engineering under Air Force Contract No. FA8702-15-D-0001. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the Dept of Energy and Under Secretary of Defense for Research and Engineering.
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Publication: R. N. Das et al., "Reworkable Superconducting Qubit Package for Quantum Computing," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 427-432.
Yost, D.R.W., Schwartz, M.E., Mallek, J. et al. Solid-state qubits integrated with superconducting through-silicon vias. npj Quantum Inf 6, 59 (2020).
D. Rosenberg et al., "Solid-State Qubits: 3D Integration and Packaging," in IEEE Microwave Magazine, vol. 21, no. 8, pp. 72-85, Aug. 2020.
Presenters
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Mollie E Schwartz
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology