Superconducting Integration, Packaging & Validation
FOCUS · MAR-B18 · ID: 3105503
Presentations
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3D-Integrated Superconducting Qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures
ORAL
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Presenters
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Thomas Mayer
- Fraunhofer EMFT
Authors
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Thomas Mayer
- Fraunhofer EMFT
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Hannes Bender
- Fraunhofer EMFT
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Simon Lang
- Fraunhofer EMFT
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Luis Schwarzenbach
- Fraunhofer EMFT
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Waltraud Hell
- Fraunhofer EMFT
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Johannes Weber
- Fraunhofer EMFT
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Carla Morán Guizán
- Fraunhofer EMFT
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Chawki Dhieb
- Fraunhofer EMFT
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Daniela Zahn
- Fraunhofer EMFT
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Zhen Luo
- Technical University of Munich (TUM)
- Fraunhofer EMFT
- TU Munich
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Mihail Andronic
- Fraunhofer EMFT
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Armin Klumpp
- Fraunhofer EMFT
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Andreas Drost
- Fraunhofer EMFT
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Karl Neumeier
- Fraunhofer EMFT
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Wilfried Lerch
- Fraunhofer EMFT
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Lars Nebrich
- Fraunhofer EMFT
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Ignaz Eisele
- Fraunhofer EMFT
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Rui N Pereira
- Fraunhofer EMFT
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Christoph Kutter
- Fraunhofer EMFT
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Scalable path towards 3D integration of superconducting qubits using advanced 300mm foundry manufacturing capabilities
ORAL
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Presenters
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A. M. Vadiraj
- IMEC
- imec
Authors
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A. M. Vadiraj
- IMEC
- imec
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Rohith Acharya
- Katholieke University Leuven
- IMEC
- imec
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Anton Potočnik
- imec
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Anish Dangol
- imec
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Jaber Derakhshandeh
- imec
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Shana Massar
- IMEC
- imec
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Maël Demarets
- KU Leuven, IMEC
- KU Leuven, imec
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Jacques Van Damme
- IMEC
- KU Leuven, imec
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Daniel Perez Lozano
- imec
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Tsvetan Ivanov
- IMEC
- imec
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Yann Canvel
- IMEC
- imec
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Adham Elshaer
- imec
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Punith Mudigere Krishne Gowda
- imec
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Ehsan Shafahian
- imec
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Bensu Tunca Altintas
- imec
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Massimo Mongillo
- IMEC
- imec
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Danny Wan
- IMEC
- imec
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Kristiaan DeGreve
- IMEC
- IMEC, KU Leuven
- imec, KU Leuven
- imec
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Characterizing superconducting airbridges fabricated using a grayscale electron-beam lithography process
ORAL
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Presenters
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Prakiran Baidya
- Friedrich-Alexander University Erlangen-Nürnberg
- Friedrich-Alexander-Universität Erlangen-Nürnberg
Authors
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Prakiran Baidya
- Friedrich-Alexander University Erlangen-Nürnberg
- Friedrich-Alexander-Universität Erlangen-Nürnberg
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Momčilo Milosavljevic
- Friedrich-Alexander University Erlangen-Nürnberg
- Friedrich-Alexander-Universität Erlangen-Nürnberg
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Murali Krishna KURMAPU
- Friedrich-Alexander University Erlangen-Nuremberg
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Victor Kemme
- Friedrich-Alexander University Erlangen-Nürnberg
- Friedrich-Alexander-Universität Erlangen-Nürnberg
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Thomas Fösel
- Friedrich-Alexander University Erlangen-Nürnberg
- Friedrich-Alexander University Erlangen-Nuremberg
- Friedrich-Alexander-Universität Erlangen-Nürnberg
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Christopher Eichler
- Friedrich-Alexander University Erlangen-Nuremberg
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Fabrication of Low-Loss Niobium Air Bridges for Superconducting Qubit Applications
ORAL
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Presenters
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Niklas Bruckmoser
- Walther-Meissner-Institute
- TU Munich
- TUM
Authors
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Niklas Bruckmoser
- Walther-Meissner-Institute
- TU Munich
- TUM
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Leon Koch
- TU Munich
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Ivan Tsitsilin
- TU Munich
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David Bunch
- Walther-Meißner-Institute
- TU Munich
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Lea Richard
- Walther-Meißner-Institute
- TU Munich
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Kedar E Honasoge
- Walther-Meißner-Institut
- Walther-Meißner-Institut, Technical University Munich
- Walther-Meißner-Institut; Technical University of Munich
- Walther Meissner Inst
- TU Munich
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Thomas Luschmann
- Walther Meissner Inst
- TU Munich
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Maria-Teresa Handschuh
- Walther-Meißner-Institut
- Walther-Meißner-Institut, Technical University Munich
- Walther-Meißner-Institut; Technical University of Munich
- TU Munich
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Lasse Soedergren
- Walther-Meißner-Institute
- TU Munich
- TUM
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Vera Bader
- Walther-Meißner-Institut
- TU Munich
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Christian Schneider
- Walther-Meissner-Institute
- TU Munich & Walther-Meißner-Institut
- TU Munich
- Walther-Meißner-Institut, Bayerische Akademie der Wissenschaften, 85748 Garching
- Walther-Meißner-Institute
- TUM
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Max Werninghaus
- TU Munich
- TU Munich, Walther-Meißner-Institute
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Stefan Filipp
- TU Munich
- TU Munich, Walther-Meißner-Institute
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Influence of scaling up technologies on transmon coherence
ORAL
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Presenters
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Leon Koch
- TU Munich
Authors
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Leon Koch
- TU Munich
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Niklas Bruckmoser
- Walther-Meissner-Institute
- TU Munich
- TUM
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Lea Richard
- Walther-Meißner-Institute
- TU Munich
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David Bunch
- Walther-Meißner-Institute
- TU Munich
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Ivan Tsitsilin
- TU Munich
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Kedar E Honasoge
- Walther-Meißner-Institut
- Walther-Meißner-Institut, Technical University Munich
- Walther-Meißner-Institut; Technical University of Munich
- Walther Meissner Inst
- TU Munich
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Maria Handschuh
- Walther-Meißner-Institute
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Lasse Soedergren
- Walther-Meißner-Institute
- TU Munich
- TUM
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Vera Bader
- Walther-Meißner-Institut
- TU Munich
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Christian Schneider
- Walther-Meissner-Institute
- TU Munich & Walther-Meißner-Institut
- TU Munich
- Walther-Meißner-Institut, Bayerische Akademie der Wissenschaften, 85748 Garching
- Walther-Meißner-Institute
- TUM
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Max Werninghaus
- TU Munich
- TU Munich, Walther-Meißner-Institute
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Stefan Filipp
- TU Munich
- TU Munich, Walther-Meißner-Institute
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Surface participation and dielectric loss in flipchip superconducting qubits
ORAL
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Presenters
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YEN-AN SHIH
- Delft University of Technology
Authors
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YEN-AN SHIH
- Delft University of Technology
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siddharth singh
- Delft University of Technology
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Rebecca Gharibaan
- Delft University of Technology
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Nataliia Zhurbina
- Delft University of Technology
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Lukas J Splitthoff
- Chalmers University of Technology
- Delft University of Technology
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Taryn Victoria Stefanski
- University of Bristol
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Christian Kraglund Andersen
- Delft University of Technology
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Efficient Routing and Interconnects for Superconducting Qubits
ORAL · Invited
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Publication: R. N. Das et al., "Reworkable Superconducting Qubit Package for Quantum Computing," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 427-432.
Yost, D.R.W., Schwartz, M.E., Mallek, J. et al. Solid-state qubits integrated with superconducting through-silicon vias. npj Quantum Inf 6, 59 (2020).
D. Rosenberg et al., "Solid-State Qubits: 3D Integration and Packaging," in IEEE Microwave Magazine, vol. 21, no. 8, pp. 72-85, Aug. 2020.Presenters
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Mollie E Schwartz
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
Authors
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Mollie E Schwartz
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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Optimizing dielectric losses in a flip-chip architecture through silicon micromachining
ORAL
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Presenters
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Nicolas Zani
- Yale University
Authors
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Nicolas Zani
- Yale University
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Yanhao Wang
- Yale University
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Suhas S Ganjam
- Google LLC
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Archan Banerjee
- Yale University
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Luigi Frunzio
- Yale University
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Robert J Schoelkopf
- Yale University
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Chip-to-chip superconducting liquid metal quantum connectors
ORAL
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Presenters
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Zhancheng Yao
- Boston University
Authors
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Zhancheng Yao
- Boston University
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Martin Sandberg
- IBM Thomas J. Watson Research Center
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David W Abraham
- IBM Thomas J. Watson Research Center
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David J Bishop
- Boston University
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Liquid metal printing for superconducting circuits
ORAL
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Presenters
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Thomas Reisinger
- Karlsruhe Institute of Technology
Authors
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Thomas Reisinger
- Karlsruhe Institute of Technology
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Navid Hussain
- Karlsruhe Institute of Technology
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Alexander Kreiner
- Karlsruhe Institute of Technology
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Haoran Duan
- Karlsruhe Institute of Technology
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Ritika Dhundhwal
- Karlsruhe Institute of Technology
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Gabriel G Marques
- Karlsruhe Institute of Technology
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Michael Hirtz
- Karlsruhe Institute of Technology
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Ioan M. Pop
- Karlsruhe Institute of Technology
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Jasmin Aghassi
- Karlsruhe Institute of Technology
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Characterizing the impacts of sequential Josephson Junction fabrication on superconducting circuit performance
ORAL
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Presenters
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Duncan Miller
- MIT Lincoln Laboratory
Authors
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Duncan Miller
- MIT Lincoln Laboratory
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Bethany M Niedzielski
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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Mallika T Randeria
- MIT Lincoln Laboratory
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Hannah M Stickler
- MIT Lincoln Laboratory
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David K Kim
- MIT Lincoln Lab
- Lincoln Laboratory, Massachusetts Institute of Technology
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Thomas M Hazard
- MIT Lincoln Laboratory
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Michael Gingras
- MIT Lincoln Laboratory
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Jeffrey M Knecht
- MIT Lincoln Laboratory
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Kyle Serniak
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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Cyrus F Hirjibehedin
- MIT Lincoln Laboratory
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Jonilyn L Yoder
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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Mollie E Schwartz
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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Physical-Size Biasing Corrections for Improved Josephson Junction Targeting
ORAL
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Presenters
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Hannah M Stickler
- MIT Lincoln Laboratory
Authors
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Hannah M Stickler
- MIT Lincoln Laboratory
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Bethany M Niedzielski
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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Michael Gingras
- MIT Lincoln Laboratory
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Jeffrey M Knecht
- MIT Lincoln Laboratory
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Kevin Grossklaus
- MIT Lincoln Laboratories
- MIT Lincoln Laboratory
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Kate Azar
- Massachusetts Institute of Technology
- MIT
- MIT Lincoln Laboratory
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Renée DePencier Piñero
- MIT Lincoln Laboratory
- Lincoln Laboratory, MIT
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Greg Calusine
- MIT Lincoln Laboratory
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Ali Sabbah
- MIT Lincoln Laboratory
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Felipe Contipelli
- MIT Lincoln Laboratory
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Duncan Miller
- MIT Lincoln Laboratory
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Arthur Kurlej
- MIT Lincoln Laboratory
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Jonilyn L Yoder
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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Mollie E Schwartz
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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William D Oliver
- Massachusetts Institute of Technology
- Massachusetts Institute of Technology (MIT)
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Kyle Serniak
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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A Compact, Extensible, and Flexible Cable Solution for Superconducting Qubit
ORAL
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Presenters
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John Cummings
- MIT Lincoln Laboratory
Authors
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John Cummings
- MIT Lincoln Laboratory
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Xhovalin Miloshi
- MIT Lincoln Laboratory
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Gabriel Cutter
- Massachusetts Institute of Technology
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Steven J Weber
- MIT Lincoln Laboratory
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Felipe Contipelli
- MIT Lincoln Laboratory
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Renée D DePencier Piñero
- MIT Lincoln Laboratory
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Michael Gingras
- MIT Lincoln Laboratory
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Jennifer Hritz
- MIT Lincoln Laboratory
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Madeline Morocco
- MIT Lincoln Laboratory
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Bethany M Niedzielski
- MIT Lincoln Laboratory
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Kyle Serniak
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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Hannah M Stickler
- MIT Lincoln Laboratory
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William D Oliver
- Massachusetts Institute of Technology
- Massachusetts Institute of Technology (MIT)
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Jonilyn L Yoder
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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Cyrus F Hirjibehedin
- MIT Lincoln Laboratory
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Mollie E Schwartz
- MIT Lincoln Laboratory
- Lincoln Laboratory, Massachusetts Institute of Technology
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